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 Dual 12-/14-/16-Bit 800 MSPS DAC with Low Power 32-Bit Complex NCO AD9785/AD9787/AD9788
FEATURES
Analog output: adjustable 8.7 mA to 31.7 mA, RL = 25 to 50 Low power, fine complex NCO allows carrier placement anywhere in DAC bandwidth while adding <300 mW power Auxiliary DACs allow I and Q gain matching and offset control Includes programmable I and Q phase compensation Internal digital upconversion capability Multiple chip synchronization interface High performance, low noise PLL clock multiplier Digital inverse sinc filter 100-lead, exposed paddle TQFP package
GENERAL DESCRIPTION
The AD9785/AD9787/AD9788 are 12-bit, 14-bit, and 16-bit, high dynamic range TxDAC(R) devices, respectively, that provide a sample rate of 800 MSPS, permitting multicarrier generation up to the Nyquist frequency. Features are included for optimizing direct conversion transmit applications, including complex digital modulation, as well as gain, phase, and offset compensation. The DAC outputs are optimized to interface seamlessly with analog quadrature modulators, such as the ADL537x family from Analog Devices, Inc. A serial peripheral interface (SPI) provides for programming and readback of many internal parameters. Full-scale output current can be programmed over a range of 10 mA to 30 mA. The AD978x family is manufactured on a 0.18 m CMOS process and operates from 1.8 V and 3.3 V supplies. It is enclosed in a 100-lead TQFP package.
APPLICATIONS
Wireless infrastructure WCDMA, CDMA2000, TD-SCDMA, WiMAX, GSM Digital high or low IF synthesis Transmit diversity Wideband communications LMDS/MMDS, point-to-point
PRODUCT HIGHLIGHTS
1. Low noise and intermodulation distortion (IMD) enable high quality synthesis of wideband signals from baseband to high intermediate frequencies. Proprietary DAC output switching technique enhances dynamic performance. CMOS data input interface with adjustable setup and hold. Low power complex 32-bit numerically controlled oscillators (NCOs).
2. 3. 4.
TYPICAL SIGNAL CHAIN
COMPLEX I AND Q DC DC DIGITAL INTERPOLATION FILTERS I DAC FPGA/ASIC/DSP Q DAC POST DAC ANALOG FILTER A
07098-001
QUADRATURE MODULATOR/ MIXER/ AMPLIFIER
LO
Figure 1.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 (c)2008 Analog Devices, Inc. All rights reserved.
AD9785/AD9787/AD9788 TABLE OF CONTENTS
Features .............................................................................................. 1 Applications....................................................................................... 1 General Description ......................................................................... 1 Product Highlights ........................................................................... 1 Typical Signal Chain......................................................................... 1 Revision History ............................................................................... 2 Specifications..................................................................................... 3 DC Specifications ......................................................................... 3 Digital Specifications ................................................................... 4 AC Specifications.......................................................................... 5 Absolute Maximum Ratings............................................................ 6 Thermal Resistance ...................................................................... 6 ESD Caution.................................................................................. 6 Pin Configurations and Function Descriptions ........................... 7 Typical Performance Characteristics ........................................... 13 Terminology .................................................................................... 20 Theory of Operation ...................................................................... 21 Serial Port Interface.................................................................... 21 SPI Register Map............................................................................. 24 SPI Register Descriptions .......................................................... 25 Input Data Ports.............................................................................. 33 Single-Port Mode........................................................................ 33 Dual-Port Mode.......................................................................... 33 Input Data Referenced to DATACLK ...................................... 33 Input Data Referenced to REFCLK.......................................... 35 Optimizing the Data Input Timing.......................................... 36 Input Data RAM......................................................................... 37 Digital Datapath ............................................................................. 38 Interpolation Filters ................................................................... 38 Quadrature Modulator .............................................................. 40 Numerically Controlled Oscillator .......................................... 40 Inverse Sinc Filter ....................................................................... 40 Digital Amplitude and Offset Control .................................... 41 Digital Phase Correction........................................................... 41 Device Synchronization................................................................. 42 Synchronization Logic Overview............................................. 42 Synchronizing Devices to a System Clock .............................. 44 Synchronizing Multiple Devices to Each Other..................... 45 Interrupt Request Operation .................................................... 46 Driving the REFCLK Input ........................................................... 47 DAC REFCLK Configuration................................................... 47 Analog Outputs............................................................................... 50 Digital Amplitude Scaling......................................................... 50 Power Dissipation........................................................................... 52 AD9785/AD9787/AD9788 Evaluation Boards........................... 54 Output Configuration................................................................ 54 Digital Picture of Evaluation Board......................................... 54 Evaluation Board Software........................................................ 55 Evaluation Board Schematics ................................................... 56 Outline Dimensions ....................................................................... 62 Ordering Guide .......................................................................... 62
REVISION HISTORY
1/08--Revision 0: Initial Version
Rev. 0 | Page 2 of 64
AD9785/AD9787/AD9788 SPECIFICATIONS
DC SPECIFICATIONS
TMIN to TMAX, AVDD33 = 3.3 V, DVDD33 = 3.3 V, DVDD18 = 1.8 V, CVDD18 = 1.8 V, IOUTFS = 20 mA, maximum sample rate, unless otherwise noted. LVDS driver and receiver are compliant to the IEEE 1596 reduced range link, unless otherwise noted. Table 1.
Parameter RESOLUTION ACCURACY Differential Nonlinearity (DNL) Integral Nonlinearity (INL) MAIN DAC OUTPUTS Offset Error Gain Error (with Internal Reference) Full-Scale Output Current Output Compliance Range Output Resistance Gain DAC Monotonicity Guaranteed MAIN DAC TEMPERATURE DRIFT Offset Gain Reference Voltage AUX DAC OUTPUTS Resolution Full-Scale Output Current 1 Output Compliance Range (Source) Output Compliance Range (Sink) Output Resistance Aux DAC Monotonicity Guaranteed REFERENCE Internal Reference Voltage Output Resistance ANALOG SUPPLY VOLTAGES AVDD33 CVDD18 DIGITAL SUPPLY VOLTAGES DVDD33 DVDD18 POWER CONSUMPTION 1x Mode, fDATA = 100 MSPS, PLL Off, IF = 2 MHz 2x Mode, fDATA = 100 MSPS, Inverse Sinc Off, PLL Off 4x Mode, fDATA = 100 MSPS, Inverse Sinc Off, PLL Off 8x Mode, fDATA = 100 MSPS, Inverse Sinc Off, PLL Off Power-Down Mode OPERATING RANGE
1
Min
AD9785 Typ Max 12 0.2 0.3
Min
AD9787 Typ Max 14 0.5 1.0
Min
AD9788 Typ Max 16 2.1 3.7
Unit Bits LSB LSB
-0.001 8.66 -1.0
0 2 20.2 10 10
+0.001 31.66 +1.0
-0.001 8.66 -1.0
0 2 20.2 10 10
+0.001 31.66 +1.0
-0.001 8.66 -1.0
0 2 20.2 10 10
+0.001 31.66 +1.0
% FSR % FSR mA V M Bits
0.04 100 30 10 -1.998 0 0.8 1 10 1.2 5 3.13 1.70 3.13 1.70 3.3 1.8 3.3 1.8 375 533 754 1054 2.5 +25 9.0 +85 3.47 1.90 3.47 1.90 450 3.13 1.70 3.13 1.70 +1.998 1.6 1.6 -1.998 0 0.8
0.04 100 30 10 +1.998 1.6 1.6 1 10 1.2 5 3.3 1.8 3.3 1.8 375 533 754 1054 2.5 +25 9.0 +85 3.47 1.90 3.47 1.90 450 3.13 1.70 3.13 1.70 -1.998 0 0.8
0.04 100 30 10 +1.998 1.6 1.6 1 10 1.2 5 3.3 1.8 3.3 1.8 375 533 754 1054 2.5 +25 9.0 +85 3.47 1.90 3.47 1.90 450
ppm/C ppm/C ppm/C Bits mA V V M Bits V k V V V V mW mW mW mW mW C
-40
-40
-40
Based on a 10 external resistor.
Rev. 0 | Page 3 of 64
AD9785/AD9787/AD9788
DIGITAL SPECIFICATIONS
TMIN to TMAX, AVDD33 = 3.3 V, DVDD33 = 3.3 V, DVDD18 = 1.8 V, CVDD18 = 1.8 V, IOUTFS = 20 mA, maximum sample rate, unless otherwise noted. Table 2.
Parameter CMOS INPUT LOGIC LEVEL Input VIN Logic High Input VIN Logic Low LVDS INPUT (SYNC_I+, SYNC_I-) Input Voltage Range, VIA or VIB Input Differential Threshold, VIDTH Input Differential Hysteresis, VIDTHH - VIDTHL Receiver Differential Input Impedance, RIN LVDS Input Rate (fSYNC_I = fDATA) Setup Time, SYNC_I to DAC Clock Hold Time, SYNC _I to DAC Clock LVDS DRIVER OUTPUTS (SYNC_O+, SYNC_O-) Output Voltage High, VOA or VOB Output Voltage Low, VOA or VOB Output Differential Voltage, |VOD| Output Offset Voltage, VOS Output Impedance, Single-Ended, RO DAC CLOCK INPUT (REFCLK+, REFCLK-) Differential Peak-to-Peak Voltage Common-Mode Voltage Maximum Clock Rate DVDD18 = 1.8 V 5% DVDD18 = 1.9 V 5% MAXIMUM INPUT DATA RATE 1x Interpolation 2x Interpolation 4x Interpolation DVDD18 = 1.8 V 5% DVDD18 = 1.9 V 5% 8x Interpolation DVDD18 = 1.8 V 5% DVDD18 = 1.9 V 5% SERIAL PERIPHERAL INTERFACE Maximum Clock Rate (SCLK) Minimum Pulse Width High Minimum Pulse Width Low Setup Time, SPI_SDIO to SCLK Hold Time, SPI_SDIO to SCLK Setup Time, SPI_CSB to SCLK Data Valid, SPI_SDO to SCLK INPUT DATA Setup Time, Input Data to DATACLK Hold Time, Input Data to DATACLK Setup Time, Input Data to REFCLK Hold Time, Input Data to REFCLK Test Conditions/Comments Min 2.0 0.8 SYNC_I+ = V1A, SYNC_I- = V1B 825 -100 20 80 30 0.45 0.25 SYNC_O+ = VOA, SYNC_O- = VOB, 100 termination 825 1025 150 1150 80 400 300 800 900 250 250 200 225 100 112.5 40 12.5 12.5 2.8 0.0 3.0 10.0 All modes, -40C to +85C 1 460 -1.5 -0.25 2.4 ns ns ns ns 1575 200 100 800 400 250 1250 120 1600 500 mV mV mV mV mV mV MHz MHz MSPS MSPS MSPS MSPS MSPS MSPS MHz ns ns ns ns ns ns 120 1575 +100 mV mV mV MHz ns ns Typ Max Unit V V
Rev. 0 | Page 4 of 64
AD9785/AD9787/AD9788
Parameter LATENCY (DACCLK CYCLES) 1x Interpolation 2x Interpolation 4x Interpolation 8x Interpolation Inverse Sinc POWER-UP TIME 2 DAC Wake-Up Time 3 DAC Sleep Time 4
1 2
Test Conditions/Comments With or without modulation With or without modulation With or without modulation With or without modulation
Min
Typ 40 83 155 294 18 260 22 22
Max
Unit Cycles Cycles Cycles Cycles Cycles ms ms ms
IOUT current settling to 1% IOUT current to less than 1% of full scale
Timing vs. temperature and data valid windows are delineated in Table 25. Measured from SPI_CSB rising edge on Register 0x00; toggle Bit 4 from 0 to 1. VREF decoupling capacitor = 0.1 F. 3 Measured from SPI_CSB rising edge on Register 0x05 or Register 0x07; toggle Bit 15 or Bit 14 from 0 to 1. 4 Measured from SPI_CSB rising edge on Register 0x05 or Register 0x07; toggle Bit 15 or Bit 14 from 1 to 0.
AC SPECIFICATIONS
TMIN to TMAX, AVDD33 = 3.3 V, DVDD33 = 3.3 V, DVDD18 = 1.8 V, CVDD18 = 1.8 V, IOUTFS = 20 mA, maximum sample rate, unless otherwise noted. Table 3.
Parameter SPURIOUS-FREE DYNAMIC RANGE (IN-BAND SFDR) fDACCLK = 200 MSPS, fOUT = 70 MHz 1x Interpolation fDACCLK = 200 MSPS, fOUT = 70 MHz 2x Interpolation fDACCLK = 200 MSPS, fOUT = 70 MHz 4x Interpolation fDACCLK = 800 MSPS, fOUT = 40 MHz 8x Interpolation TWO-TONE INTERMODULATION DISTORTION (IMD) fDATA = 200 MSPS, fOUT = 50 MHz 1x Interpolation fDATA = 200 MSPS, fOUT = 50 MHz 2x Interpolation fDATA = 200 MSPS, fOUT = 100 MHz 4x Interpolation fDATA = 100 MSPS, fOUT = 100 MHz 8x Interpolation NOISE SPECTRAL DENSITY (NSD), EIGHT TONE, 500 kHz TONE SPACING fDACCLK = 200 MSPS, fOUT = 80 MHz fDACCLK = 400 MSPS, fOUT = 80 MHz fDACCLK = 800 MSPS, fOUT = 80 MHz WCDMA ADJACENT CHANNEL LEAKAGE RATIO (ACLR), SINGLE CARRIER fDACCLK = 491.52 MSPS, fOUT = 100 MHz 4x Interpolation fDACCLK = 491.52 MSPS, fOUT = 200 MHz 4x Interpolation WCDMA SECOND ADJACENT CHANNEL LEAKAGE RATIO (ACLR), SINGLE CARRIER fDACCLK = 491.52 MSPS, fOUT = 100 MHz 4x Interpolation fDACCLK = 491.52 MSPS, fOUT = 200 MHz 4x Interpolation AD9785 Min Typ Max 80 80 78 85 80 78 78 70 AD9787 Min Typ Max 82 82 80 87 82 79 79 70 AD9788 Min Typ Max 83 83 81 90 83 80 80 70 Unit dBc dBc dBc dBc dBc dBc dBc dBc
-154 -154 -154
-157 -158 -159
-158 -161 -162
dBm/Hz dBm/Hz dBm/Hz
78 72
80 74
82 76
dBc dBc
80 78
82 80
88 82
dBc dBc
Rev. 0 | Page 5 of 64
AD9785/AD9787/AD9788 ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter AVDD33 to AGND, DGND, CGND DVDD33, DVDD18, CVDD18 to AGND, DGND, CGND AGND to DGND, CGND DGND to AGND, CGND CGND to AGND, DGND I120, VREF, IPTAT to AGND OUT1_P, OUT1_N, OUT2_P, OUT2_N, AUX1_P, AUX1_N, AUX2_P, AUX2_N to AGND P1D[15] to P1D[0], P2D[15] to P2D[0] to DGND DATACLK, TXENABLE to DGND REFCLK+, REFCLK-, RESET, IRQ, PLL_LOCK, SYNC_O+, SYNC_O-, SYNC_I+, SYNC_I- to CGND RESET, IRQ, PLL_LOCK, SYNC_O+, SYNC_O-, SYNC_I+, SYNC_I-, SPI_CSB, SCLK, SPI_SDIO, SPI_SDO to DGND Junction Temperature Storage Temperature Range Rating -0.3 V to +3.6 V -0.3 V to +2.1 V -0.3 V to +0.3 V -0.3 V to +0.3 V -0.3 V to +0.3 V -0.3 V to AVDD33 + 0.3 V -1.0 V to AVDD33 + 0.3 V
THERMAL RESISTANCE
For this 100-lead, thermally enhanced TQFP, the exposed paddle (EPAD) must be soldered to the ground plane. Note that these specifications are valid with no airflow movement. Table 5. Thermal Resistance
Resistance JA JB JC Unit 19.1C/W 12.4C/W 7.1C/W Conditions EPAD soldered. No airflow. EPAD soldered. No airflow. EPAD soldered. No airflow.
-0.3 V to DVDD33 + 0.3 V -0.3 V to DVDD33 + 0.3 V -0.3 V to CVDD18 + 0.3 V
ESD CAUTION
-0.3 V to DVDD33 + 0.3 V
125C -65C to +150C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Rev. 0 | Page 6 of 64
AD9785/AD9787/AD9788 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
OUT2_N OUT1_N AVDD33 AVDD33 AVDD33 AVDD33 AVDD33
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
CVDD18 CVDD18 CGND CGND REFCLK+ REFCLK- CGND CGND CVDD18
AVDD33
AUX1_N
AUX2_N
OUT2_P
OUT1_P
AUX1_P
AUX2_P
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
1 2 3 4 5 6 7 8 9 PIN 1 INDICATOR
75 74
I120 VREF IPTAT AGND IRQ RESET SPI_CSB SCLK SPI_SDIO SPI_SDO PLL_LOCK DGND SYNC_O+ SYNC_O- DVDD33 DVDD18 NC NC NC NC P2D[0] DGND DVDD18 P2D[1] P2D[2]
ANALOG DOMAIN
73 72 71
DIGITAL DOMAIN
70 69 68
AD9785
TOP VIEW (Not to Scale)
67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
CVDD18 10 CGND 11 AGND 12 SYNC_I+ 13 SYNC_I- 14 DGND 15 DVDD18 16 P1D[11] 17 P1D[10] 18 P1D[9] 19 P1D[8] 20 P1D[7] 21 DGND 22 DVDD18 23 P1D[6] 24 P1D[5] 25
TXENABLE
NC
NC
NC
DGND
NC
DATACLK
P1D[4]
P1D[3]
P1D[2]
P1D[1]
P1D[0]
P2D[9]
DGND
P2D[8]
P2D[7]
P2D[6]
P2D[5]
P2D[4]
DVDD18
DVDD33
DVDD18
P2D[11]
P2D[10]
P2D[3]
NC = NO CONNECT
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
Figure 2. AD9785 Pin Configuration
Table 6. AD9785 Pin Function Descriptions
Pin No. 1, 2, 9, 10 3, 4, 7, 8, 11 5 6 12, 72, 77, 79, 81, 82, 85, 88, 91, 94, 95, 97, 99 13 14 15, 22, 32, 44, 54, 64 16, 23, 33, 43, 53, 60 17 18 19 20 21 24 25 26 27 28 Mnemonic CVDD18 CGND REFCLK+ REFCLK- AGND SYNC_I+ SYNC_I- DGND DVDD18 P1D[11] P1D[10] P1D[9] P1D[8] P1D[7] P1D[6] P1D[5] P1D[4] P1D[3] P1D[2] Description 1.8 V Clock Supply. Clock Common. Differential Clock Input, Positive. Differential Clock Input, Negative. Analog Common. Differential Synchronization Input, Positive. Differential Synchronization Input, Negative. Digital Common. 1.8 V Digital Supply. Port 1, Data Input D11 (MSB). Port 1, Data Input D10. Port 1, Data Input D9. Port 1, Data Input D8. Port 1, Data Input D7. Port 1, Data Input D6. Port 1, Data Input D5. Port 1, Data Input D4. Port 1, Data Input D3. Port 1, Data Input D2.
Rev. 0 | Page 7 of 64
07098-005
AD9785/AD9787/AD9788
Pin No. 29 30 31, 34 to 36, 56 to 59 37 38, 61 39 40 41 42 45 46 47 48 49 50 51 52 55 62 63 65 66 67 68 69 70 71 73 74 75 76, 78, 80, 96, 98, 100 83 84 86 87 89 90 92 93 Exposed Paddle Mnemonic P1D[1] P1D[0] NC DATACLK DVDD33 TXENABLE P2D[11] P2D[10] P2D[9] P2D[8] P2D[7] P2D[6] P2D[5] P2D[4] P2D[3] P2D[2] P2D[1] P2D[0] SYNC_O- SYNC_O+ PLL_LOCK SPI_SDO SPI_SDIO SCLK SPI_CSB RESET IRQ IPTAT VREF I120 AVDD33 OUT2_P OUT2_N AUX2_P AUX2_N AUX1_N AUX1_P OUT1_N OUT1_P EPAD Description Port 1, Data Input D1. Port 1, Data Input D0 (LSB). No Connection Necessary. Data Clock Output. 3.3 V Digital Supply. Transmit Enable. Port 2, Data Input D11 (MSB). Port 2, Data Input D10. Port 2, Data Input D9. Port 2, Data Input D8. Port 2, Data Input D7. Port 2, Data Input D6. Port 2, Data Input D5. Port 2, Data Input D4. Port 2, Data Input D3. Port 2, Data Input D2. Port 2, Data Input D1. Port 2, Data Input D0 (LSB). Differential Synchronization Output, Negative. Differential Synchronization Output, Positive. PLL Lock Indicator. SPI Port Data Output. SPI Port Data Input/Output. SPI Port Clock. SPI Port Chip Select Bar. Reset, Active High. Interrupt Request. Factory Test Pin. Output current is proportional to absolute temperature, approximately 10 A at 25C with approximately 20 nA/C slope. This pin should remain floating. Voltage Reference Output. 120 A Reference Current. 3.3 V Analog Supply. Differential DAC Current Output, Positive, Channel 2. Differential DAC Current Output, Negative, Channel 2. Auxiliary DAC Current Output, Positive, Channel 2. Auxiliary DAC Current Output, Negative, Channel 2. Auxiliary DAC Current Output, Negative, Channel 1. Auxiliary DAC Current Output, Positive, Channel 1. Differential DAC Current Output, Negative, Channel 1. Differential DAC Current Output, Positive, Channel 1. Conductive Heat Sink. Connect to analog common (AGND).
Rev. 0 | Page 8 of 64
AD9785/AD9787/AD9788
OUT2_N OUT1_N AVDD33 AVDD33 AVDD33 AVDD33 AVDD33 AVDD33 AUX1_N AUX2_N OUT2_P OUT1_P AUX1_P AUX2_P AGND AGND AGND AGND AGND AGND AGND AGND AGND AGND AGND
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
CVDD18 CVDD18 CGND CGND REFCLK+ REFCLK- CGND CGND CVDD18
1 2 3 4 5 6 7 8 9 PIN 1 INDICATOR
75 74
I120 VREF IPTAT AGND IRQ RESET SPI_CSB SCLK SPI_SDIO SPI_SDO PLL_LOCK DGND SYNC_O+ SYNC_O- DVDD33 DVDD18 NC NC P2D[0] P2D[1] P2D[2] DGND DVDD18 P2D[3] P2D[4]
ANALOG DOMAIN
73 72 71
DIGITAL DOMAIN
70 69 68
AD9787
TOP VIEW (Not to Scale)
67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
CVDD18 10 CGND 11 AGND 12 SYNC_I+ 13 SYNC_I- 14 DGND 15 DVDD18 16 P1D[13] 17 P1D[12] 18 P1D[11] 19 P1D[10] 20 P1D[9] 21 DGND 22 DVDD18 23 P1D[8] 24 P1D[7] 25
TXENABLE
NC
DGND
NC
DATACLK
P1D[6]
P1D[5]
P1D[4]
P1D[3]
P1D[2]
P1D[1]
P1D[0]
DGND
P2D[9]
P2D[8]
P2D[7]
P2D[6]
DVDD18
DVDD33
DVDD18
P2D[13]
P2D[12]
P2D[11]
P2D[10]
P2D[5]
NC = NO CONNECT
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
Figure 3. AD9787 Pin Configuration
Table 7. AD9787 Pin Function Descriptions
Pin No. 1, 2, 9, 10 3, 4, 7, 8, 11 5 6 12, 72, 77, 79, 81, 82, 85, 88, 91, 94, 95, 97, 99 13 14 15, 22, 32, 44, 54, 64 16, 23, 33, 43, 53, 60 17 18 19 20 21 24 25 26 27 28 29 30 Mnemonic CVDD18 CGND REFCLK+ REFCLK- AGND SYNC_I+ SYNC_I- DGND DVDD18 P1D[13] P1D[12] P1D[11] P1D[10] P1D[9] P1D[8] P1D[7] P1D[6] P1D[5] P1D[4] P1D[3] P1D[2] Description 1.8 V Clock Supply. Clock Common. Differential Clock Input, Positive. Differential Clock Input, Negative. Analog Common. Differential Synchronization Input, Positive. Differential Synchronization Input, Negative. Digital Common. 1.8 V Digital Supply. Port 1, Data Input D13 (MSB). Port 1, Data Input D12. Port 1, Data Input D11. Port 1, Data Input D10. Port 1, Data Input D9. Port 1, Data Input D8. Port 1, Data Input D7. Port 1, Data Input D6. Port 1, Data Input D5. Port 1, Data Input D4. Port 1, Data Input D3. Port 1, Data Input D2.
Rev. 0 | Page 9 of 64
07098-004
AD9785/AD9787/AD9788
Pin No. 31 34 35, 36, 58, 59 37 38, 61 39 40 41 42 45 46 47 48 49 50 51 52 55 56 57 62 63 65 66 67 68 69 70 71 73 74 75 76, 78, 80, 96, 98, 100 83 84 86 87 89 90 92 93 Exposed Paddle Mnemonic P1D[1] P1D[0] NC DATACLK DVDD33 TXENABLE P2D[13] P2D[12] P2D[11] P2D[10] P2D[9] P2D[8] P2D[7] P2D[6] P2D[5] P2D[4] P2D[3] P2D[2] P2D[1] P2D[0] SYNC_O- SYNC_O+ PLL_LOCK SPI_SDO SPI_SDIO SCLK SPI_CSB RESET IRQ IPTAT VREF I120 AVDD33 OUT2_P OUT2_N AUX2_P AUX2_N AUX1_N AUX1_P OUT1_N OUT1_P EPAD Description Port 1, Data Input D1. Port 1, Data Input D0 (LSB). No Connection Necessary. Data Clock Output. 3.3 V Digital Supply. Transmit Enable. Port 2, Data Input D13 (MSB). Port 2, Data Input D12. Port 2, Data Input D11. Port 2, Data Input D10. Port 2, Data Input D9. Port 2, Data Input D8. Port 2, Data Input D7. Port 2, Data Input D6. Port 2, Data Input D5. Port 2, Data Input D4. Port 2, Data Input D3. Port 2, Data Input D2. Port 2, Data Input D1. Port 2, Data Input D0 (LSB). Differential Synchronization Output, Negative. Differential Synchronization Output, Positive. PLL Lock Indicator. SPI Port Data Output. SPI Port Data Input/Output. SPI Port Clock. SPI Port Chip Select Bar. Reset, Active High. Interrupt Request. Factory Test Pin. Output current is proportional to absolute temperature, approximately 10 A at 25C with approximately 20 nA/C slope. This pin should remain floating. Voltage Reference Output. 120 A Reference Current. 3.3 V Analog Supply. Differential DAC Current Output, Positive, Channel 2. Differential DAC Current Output, Negative, Channel 2. Auxiliary DAC Current Output, Positive, Channel 2. Auxiliary DAC Current Output, Negative, Channel 2. Auxiliary DAC Current Output, Negative, Channel 1. Auxiliary DAC Current Output, Positive, Channel 1. Differential DAC Current Output, Negative, Channel 1. Differential DAC Current Output, Positive, Channel 1. Conductive Heat Sink. Connect to analog common (AGND).
Rev. 0 | Page 10 of 64
AD9785/AD9787/AD9788
OUT2_N OUT1_N AVDD33 AVDD33 AVDD33 AVDD33 AVDD33 AVDD33 AUX1_N AUX2_N OUT2_P OUT1_P AUX1_P AUX2_P AGND AGND AGND AGND AGND AGND AGND AGND AGND AGND AGND
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
CVDD18 CVDD18 CGND CGND REFCLK+ REFCLK- CGND CGND CVDD18
1 2 3 4 5 6 7 8 9 PIN 1 INDICATOR
75 74
I120 VREF IPTAT AGND IRQ RESET SPI_CSB SCLK SPI_SDIO SPI_SDO PLL_LOCK DGND SYNC_O+ SYNC_O- DVDD33 DVDD18 P2D[0] P2D[1] P2D[2] P2D[3] P2D[4] DGND DVDD18 P2D[5] P2D[6]
ANALOG DOMAIN
73 72 71
DIGITAL DOMAIN
70 69 68
AD9788
TOP VIEW (Not to Scale)
67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
CVDD18 10 CGND 11 AGND 12 SYNC_I+ 13 SYNC_I- 14 DGND 15 DVDD18 16 P1D[15] 17 P1D[14] 18 P1D[13] 19 P1D[12] 20 P1D[11] 21 DGND 22 DVDD18 23 P1D[10] 24 P1D[9] 25
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
TXENABLE
DGND
DATACLK
P1D[8]
P1D[7]
P1D[6]
P1D[5]
P1D[4]
P1D[3]
P1D[2]
P1D[1]
P1D[0]
DGND
P2D[9]
P2D[8]
P2D[15]
P2D[14]
P2D[13]
P2D[12]
P2D[11]
DVDD18
DVDD33
DVDD18
P2D[10]
P2D[7]
Figure 4. AD9788 Pin Configuration
Table 8. AD9788 Pin Function Descriptions
Pin No. 1, 2, 9, 10 3, 4, 7, 8, 11 5 6 12, 72, 77, 79, 81, 82, 85, 88, 91, 94, 95, 97, 99 13 14 15, 22, 32, 44, 54, 64 16, 23, 33, 43, 53, 60 17 18 19 20 21 24 25 26 27 28 29 30 Mnemonic CVDD18 CGND REFCLK+ REFCLK- AGND SYNC_I+ SYNC_I- DGND DVDD18 P1D[15] P1D[14] P1D[13] P1D[12] P1D[11] P1D[10] P1D[9] P1D[8] P1D[7] P1D[6] P1D[5] P1D[4] Description 1.8 V Clock Supply. Clock Common. Differential Clock Input, Positive. Differential Clock Input, Negative. Analog Common. Differential Synchronization Input, Positive. Differential Synchronization Input, Negative. Digital Common. 1.8 V Digital Supply. Port 1, Data Input D15 (MSB). Port 1, Data Input D14. Port 1, Data Input D13. Port 1, Data Input D12. Port 1, Data Input D11. Port 1, Data Input D10. Port 1, Data Input D9. Port 1, Data Input D8. Port 1, Data Input D7. Port 1, Data Input D6. Port 1, Data Input D5. Port 1, Data Input D4.
Rev. 0 | Page 11 of 64
07098-003
AD9785/AD9787/AD9788
Pin No. 31 34 35 36 37 38, 61 39 40 41 42 45 46 47 48 49 50 51 52 55 56 57 58 59 62 63 65 66 67 68 69 70 71 73 74 75 76, 78, 80, 96, 98, 100 83 84 86 87 89 90 92 93 Exposed Paddle Mnemonic P1D[3] P1D[2] P1D[1] P1D[0] DATACLK DVDD33 TXENABLE P2D[15] P2D[14] P2D[13] P2D[12] P2D[11] P2D[10] P2D[9] P2D[8] P2D[7] P2D[6] P2D[5] P2D[4] P2D[3] P2D[2] P2D[1] P2D[0] SYNC_O- SYNC_O+ PLL_LOCK SPI_SDO SPI_SDIO SCLK SPI_CSB RESET IRQ IPTAT VREF I120 AVDD33 OUT2_P OUT2_N AUX2_P AUX2_N AUX1_N AUX1_P OUT1_N OUT1_P EPAD Description Port 1, Data Input D3. Port 1, Data Input D2. Port 1, Data Input D1. Port 1, Data Input D0 (LSB). Data Clock Output. 3.3 V Digital Supply. Transmit Enable. Port 2, Data Input D15 (MSB). Port 2, Data Input D14. Port 2, Data Input D13. Port 2, Data Input D12. Port 2, Data Input D11. Port 2, Data Input D10. Port 2, Data Input D9. Port 2, Data Input D8. Port 2, Data Input D7. Port 2, Data Input D6. Port 2, Data Input D5. Port 2, Data Input D4. Port 2, Data Input D3. Port 2, Data Input D2. Port 2, Data Input D1. Port 2, Data Input D0 (LSB). Differential Synchronization Output, Negative. Differential Synchronization Output, Positive. PLL Lock Indicator. SPI Port Data Output. SPI Port Data Input/Output. SPI Port Clock. SPI Port Chip Select Bar. Reset, Active High. Interrupt Request. Factory Test Pin. Output current is proportional to absolute temperature, approximately 10 A at 25C with approximately 20 nA/C slope. This pin should remain floating. Voltage Reference Output. 120 A Reference Current. 3.3 V Analog Supply. Differential DAC Current Output, Positive, Channel 2. Differential DAC Current Output, Negative, Channel 2. Auxiliary DAC Current Output, Positive, Channel 2. Auxiliary DAC Current Output, Negative, Channel 2. Auxiliary DAC Current Output, Negative, Channel 1. Auxiliary DAC Current Output, Positive, Channel 1. Differential DAC Current Output, Negative, Channel 1. Differential DAC Current Output, Positive, Channel 1. Conductive Heat Sink. Connect to analog common (AGND).
Rev. 0 | Page 12 of 64
AD9785/AD9787/AD9788 TYPICAL PERFORMANCE CHARACTERISTICS
-142 -146 4x -150
NSD (dBm/Hz)
100 95 90 2x
SFDR (dB)
200 MSPS
250 MSPS
85 80 75 70 65 60 160 MSPS
-154 -158 -162 -166 -170 1x
55 0 20 40 60 80 100 50
07098-064
fOUT (MHz)
fOUT (MHz)
Figure 5. AD9785 Noise Spectral Density vs. fOUT, Multitone Input, fDATA = 200 MSPS
-142 -146 2x -150
NSD (dBm/Hz)
Figure 8. AD9785 In-Band SFDR vs. fOUT, 2x Interpolation
100
90 150 MSPS 4x
IMD (dBc)
-154 -158 -162
80
1x
70 100 MSPS 60 200 MSPS
-166 -170 50
07098-065
fOUT (MHz)
fOUT (MHz)
Figure 6. AD9785 Noise Spectral Density vs. fOUT, Single-Tone Input, fDATA = 200 MSPS
-55 -60 -65
ACLR (dBc)
Figure 9. AD9785 IMD vs. fOUT, 4x Interpolation
-55 -60 -65
ACLR (dBc)
FIRST ADJ CHAN -70 -75 SECOND ADJ CHAN -80 -85 -90
-70 -75 -80 -85 -90 SECOND ADJ CHAN
FIRST ADJ CHAN
THIRD ADJ CHAN 0 20 40 60 80 100 120 140 160 180 200 220 240 260
THIRD ADJ CHAN 0 20 40 60 80 100 120 140 160 180 200 220 240 260
07098-066
fOUT (MHz)
fOUT (MHz)
Figure 7. AD9785 ACLR, 4x Interpolation, fDATA = 122.88 MSPS
Figure 10. AD9787 ACLR, 4x Interpolation, fDATA = 122.88 MSPS
Rev. 0 | Page 13 of 64
07098-069
07098-068
0
20
40
60
80
100
0
40
80
120
160
200
240
280
320
360
400
07098-067
0
20
40
60
80
100
AD9785/AD9787/AD9788
-55 -60 -65
NSD (dBm/Hz)
ACLR (dBc)
-142 -146 -150 -154 -158 -162 -166 -170
-70 FIRST ADJ CHAN -75 -80 -85 -90 SECOND ADJ CHAN
1x 4x
2x
THIRD ADJ CHAN
07098-070
fOUT (MHz)
fOUT (MHz)
Figure 11. AD9787 ACLR, 4x Interpolation, fDATA = 122.88 MSPS, Amplitude = -3 dB
100
Figure 14. AD9787 Noise Spectral Density vs. fOUT over Output Frequency of Multitone Input, fDATA = 200 MSPS
-142 -146
90
-150
80 200MSPS 70 100MSPS 150MSPS 60
NSD (dBm/Hz)
IMD (dBc)
-154 1x -158 -162 -166 2x 4x
07098-071
0
40
80
120
160
200
240
280
320
360
400
fOUT (MHz)
fOUT (MHz)
Figure 12. AD9787 IMD vs. fOUT, 4x Interpolation
100 95 90 85 160MSPS
Figure 15. AD9787 Noise Spectral Density vs. fOUT, Single-Tone Input, fDATA = 200 MSPS
-55 -60 -65
ACLR (dBc)
0 dBFS PLL ON
SFDR (dB)
80 75 70 65 60 55
250MSPS 200MSPS
-70 -75 -80 -85 -90
0 dBFS PLL OFF -3 dBFS PLL OFF
-6 dBFS PLL OFF
07098-076
07098-072
50
0
20
40
60
80
100
0
20
40
60
80 100 120 140 160 180 200 220 240 260
fOUT (MHz)
fOUT (MHz)
Figure 13. AD9787 In-Band SFDR vs. fOUT, 2x Interpolation
Figure 16. AD9788 ACLR for First Adjacent Band WCDMA, 4x Interpolation, fDATA = 122.88 MSPS, NCO Translates Baseband Signal to IF
Rev. 0 | Page 14 of 64
07098-074
50
-170
0
20
40
60
80
100
07098-073
0
20
40
60
80 100 120 140 160 180 200 220 240 260
0
20
40
60
80
100
AD9785/AD9787/AD9788
-55 -60 90 -65
ACLR (dBc)
100
200MSPS
-70 -75 -80
IMD (dBc)
0 dBFS PLL ON -6 dBFS PLL OFF
80
160MSPS 250MSPS
70
60 -85 -3 dBFS PLL OFF -90 0 20 40 60 0 dBFS PLL OFF
07098-077 07098-080 07098-082
80 100 120 140 160 180 200 220 240 260
50
0
50
100
150
200
fOUT (MHz)
fOUT (MHz)
Figure 17. AD9788 ACLR for Second Adjacent Band WCDMA, 4x Interpolation, fDATA = 122.88 MSPS, NCO Translates Baseband Signal to IF
-70 100
Figure 20. AD9788 IMD vs. fOUT, 2x Interpolation
-75 0 dBFS PLL ON
ACLR (dBc) IMD (dBc)
90
80
-80
-6 dBFS PLL OFF
150MSPS
70 100MSPS
200MSPS
-85
-3 dBFS PLL OFF
0 dBFS PLL OFF
60
07098-078
0
20
40
60
80 100 120 140 160 180 200 220 240 260
fOUT (MHz)
fOUT (MHz)
Figure 18. AD9788 ACLR for Third Adjacent Band WCDMA, 4x Interpolation, fDATA = 122.88 MSPS, NCO Translates Baseband Signal to IF
100 100
Figure 21. AD9788 IMD vs. fOUT, 4x Interpolation
90
160MSPS
250MSPS
90
IMD (dBc)
200MSPS 70
IMD (dBc)
80
80 PLL ON 70 PLL OFF
60
60
07098-079
50
0
20
40
60
80
100
120
50
0
20
40
60
80
100
120
140
160
180
200
fOUT (MHz)
fOUT (MHz)
Figure 19. AD9788 IMD vs. fOUT, 1x Interpolation
Figure 22. AD9788 IMD vs. fOUT, 8x Interpolation, fDATA = 100 MSPS, PLL On/PLL Off
Rev. 0 | Page 15 of 64
07098-081
-90
50
0
40
80
120
160
200
240
280
320
360
400
AD9785/AD9787/AD9788
100
100 95
90
90 85
IMD (dBc)
75MSPS
IMD (dBc)
80
80 75 70 65 60 55
70
50MSPS 100MSPS
60
07098-083
0
50
100
150
200
250
300
350
400
450
fOUT (MHz)
fOUT (MHz)
Figure 23. AD9788 IMD vs. fOUT, 8x Interpolation
100
Figure 26. AD9788 IMD vs. fOUT, over 50 Parts, 4x Interpolation, fDATA = 200 MSPS
-142 -146
90
-150
80 0dBFS 70 -3dBFS -6dBFS
NSD (dBm/Hz)
IMD (dBc)
-154 -3dBFS -158 0dBFS -162
60
-6dBFS -166
07098-084
0
40
80
120
160
200
240
280
320
360
400
0
20
40
60
80
100
fOUT (MHz)
fOUT (MHz)
Figure 24. AD9788 IMD Performance vs. Digital Full-Scale Input, 4x Interpolation, fDATA = 200 MSPS
100
Figure 27. AD9788 Noise Spectral Density vs. Digital Full-Scale Single-Tone Input, fDATA = 200 MSPS, 2x Interpolation
-142 -146
90 20mA
IMD (dBc)
-150
80 30mA 70 10mA 60
NSD (dBm/Hz)
-154 -158 2x -162 8x -166 4x
fOUT (MHz)
07098-085
0
40
80
120
160
200
240
280
320
360
400
0
10
20
30
40
50
fOUT (MHz)
Figure 25. AD9788 IMD Performance vs. Full-Scale Output Current, 4x Interpolation, fDATA = 200 MSPS
Figure 28. AD9788 Noise Spectral Density vs. fOUT, Multitone Input, fDATA = 100 MSPS
Rev. 0 | Page 16 of 64
07098-088
50
-170
07098-087
50
-170
07098-086
50
50
0
40
80
120
160
200
240
280
320
360
400
AD9785/AD9787/AD9788
-142 -146 -150 90 85 80 160MSPS 75 -154 -158 -162 -166 -170
SFDR (dB)
200MSPS
NSD (dBm/Hz)
70 250MSPS 65 60 55 50
2x 4x 8x
07098-089
0
10
20
30
40
50
0
20
40
60
80
100
fOUT (MHz)
fOUT (MHz)
Figure 29. AD9788 Noise Spectral Density vs. fOUT, Single-Tone Input, fDATA = 100 MSPS
-142 -146 -150 NSD (dBm/Hz) -154 -158 -162 4x -166 -170
SFDR (dB)
Figure 32. AD9788 In-Band SFDR vs. fOUT, 1x Interpolation
80
75 200MSPS 160MSPS
250MSPS
70
65
1x 2x
60
55
07098-090
0
20
40
60
80
100
0
10
20
30
40
50
60
70
80
90
100
fOUT (MHz)
fOUT (MHz)
Figure 30. AD9788 Noise Spectral Density vs. fDAC, Eight-Tone Input with 500 kHz Spacing, fDATA = 200 MSPS
-142 -146 -150
Figure 33. AD9788 Out-of-Band SFDR vs. fOUT, 2x Interpolation
95 90 10mA 85 80 20mA
NSD (dBm/Hz)
-154 1x -158 2x -162 4x -166 -170
SFDR (dB)
75 30mA 70 65 60 55
07098-091
0
20
40
60
80
100
0
10
20
30
40
50
60
70
80
fOUT (MHz)
fOUT (MHz)
Figure 31. AD9788 Noise Spectral Density vs. fDAC, Full-Scale Single-Tone Input at -6 dB, fDATA = 200 MSPS
Figure 34. AD9788 In-Band SFDR vs. Full-Scale Output Current, 2x Interpolation, fDATA = 200 MSPS
Rev. 0 | Page 17 of 64
07098-094
50
07098-093
50
07098-092
AD9785/AD9787/AD9788
110 100MSPS 100 150MSPS 90 SFDR (dB) SFDR (dB) 200MSPS 80 100 95 90 85 80 75 70 65 60 55
07098-095
160MSPS 250MSPS
200MSPS
70
60
0
10
20
30
40
50
60
70
80
90
0
20
40
60
80
100
fOUT (MHz)
fOUT (MHz)
Figure 35. AD9788 In-Band SFDR vs. fOUT, 4x Interpolation
80 100MSPS
Figure 38. AD9788 In-Band SFDR vs. fOUT, 2x Interpolation
110 100MSPS 50MSPS
75
100
70
SFDR (dB)
150MSPS 200MSPS
SFDR (dB)
90
65
80
60
70
55
60
07098-096
0
10
20
30
40
50
60
70
80
90
0
10
20
30
40
50
fOUT (MHz)
fOUT (MHz)
Figure 36. AD9788 Out-of-Band SFDR vs. fOUT, 4x Interpolation
90 85 80 -6dBFS 75 SFDR (dB) 70 65 60 55 50 SFDR (dB) 0dBFS -3dBFS
Figure 39. AD9788 In-Band SFDR vs. fOUT, 8x Interpolation
90 50MSPS 85 80 75 70 65 60 55 50 100MSPS
0
5
10
15
20
25
30
35
40
45
fOUT (MHz)
fOUT (MHz)
Figure 37. AD9788 In-Band SFDR vs. Digital Full-Scale Input, 2x Interpolation, fDATA = 200 MSPS
Figure 40. AD9788 Out-of-Band SFDR vs. fOUT, 8x Interpolation
Rev. 0 | Page 18 of 64
07098-100
0
10
20
30
40
50
60
70
80
07098-097
07098-099
50
50
07098-098
50
50
AD9785/AD9787/AD9788
110 PLL OFF 100 PLL ON 90 SFDR (dB)
80
70
60
0
10
20
30
40
50
fOUT (MHz)
Figure 41. AD9788 In-Band SFDR vs. fOUT, 4x Interpolation, fDATA = 100 MSPS, PLL On/PLL Off
07098-101
50
Rev. 0 | Page 19 of 64
AD9785/AD9787/AD9788 TERMINOLOGY
Integral Nonlinearity (INL) INL is defined as the maximum deviation of the actual analog output from the ideal output, determined by a straight line drawn from zero scale to full scale. Differential Nonlinearity (DNL) DNL is the measure of the variation in analog value, normalized to full scale, associated with a 1 LSB change in digital input code. Monotonicity A DAC is monotonic if the output either increases or remains constant as the digital input increases. Offset Error The deviation of the output current from the ideal of zero is called offset error. For IOUTA, 0 mA output is expected when the inputs are all 0s. For IOUTB, 0 mA output is expected when all inputs are set to 1. Gain Error The difference between the actual and ideal output span is called gain error. The actual span is determined by the difference between the output when all inputs are set to 1 and the output when all inputs are set to 0. Output Compliance Range The output compliance range is the range of allowable voltage at the output of a current output DAC. Operation beyond the maximum compliance limits can cause either output stage saturation or breakdown, resulting in nonlinear performance. Temperature Drift Temperature drift is specified as the maximum change from the ambient (25C) value to the value at either TMIN or TMAX. For offset and gain drift, the drift is reported in ppm of full-scale range (FSR) per degree Celsius. For reference drift, the drift is reported in ppm per degree Celsius. Power Supply Rejection (PSR) PSR is the maximum change in the full-scale output as the supplies are varied from minimum to maximum specified voltages. Settling Time Settling time is the time required for the output to reach and remain within a specified error band around its final value, measured from the start of the output transition. Spurious-Free Dynamic Range (SFDR) Spurious-free dynamic range is the difference, in decibels, between the peak amplitude of the output signal and the peak amplitude of the largest spurious signal in a given frequency band from the signal. For out-of-band SFDR, the frequency band is 0 to one half the DAC sample rate. For in-band SFDR, the frequency band is 0 to one half the input data rate. Total Harmonic Distortion (THD) THD is the ratio of the rms sum of the first six harmonic components to the rms value of the measured fundamental. It is expressed as a percentage or in decibels. Noise Spectral Density (NSD) NSD is the noise power at the analog output measured in a 1 Hz bandwidth. Interpolation Filter If the digital inputs to the DAC are sampled at a multiple rate of fDATA (interpolation rate), a digital filter can be constructed that has a sharp transition band near fDATA/2. Images that typically appear around fDAC (output data rate) can be greatly suppressed. Adjacent Channel Leakage Ratio (ACLR) ACLR is the ratio in dBc between the measured power within a channel relative to its adjacent channel. Complex Image Rejection In a traditional two-part upconversion, two images are created around the second intermediate frequency (IF). These images have the effect of wasting transmitter power and system bandwidth. By placing the real part of a second complex modulator in series with the first complex modulator, either the upper or lower frequency image near the second IF can be rejected. Sinc Sinc is shorthand for the mathematical function sinc(x) = sin(x)/x This function is a useful tool for digital signal processing. The normalized sinc function is used here and is defined as follows: sinc(x) = sin( x x)/( x x)
Rev. 0 | Page 20 of 64
AD9785/AD9787/AD9788 THEORY OF OPERATION
The AD9785/AD9787/AD9788 devices combine many features that make them very attractive DACs for wired and wireless communications systems. The dual digital signal path and dual DAC structure allow an easy interface to common quadrature modulators when designing single sideband transmitters. The speed and performance of the AD9785/AD9787/AD9788 allow wider bandwidths and more carriers to be synthesized than in previously available DACs. In addition, these devices include an innovative low power, 32-bit complex NCO that greatly increases the ease of frequency placement. The AD9785/AD9787/AD9788 offer features that allow simplified synchronization with incoming data and between multiple parts, as well as the capability to phase synchronize NCOs on multiple devices. Auxiliary DACs are also provided on chip for output dc offset compensation (for LO compensation in SSB transmitters) and for gain matching (for image rejection optimization in SSB transmitters). Another innovative feature in the devices is the digitally programmable output phase compensation, which increases the amount of image cancellation capability in SSB (single sideband) transmitters.
SERIAL PORT INTERFACE
The AD9785/AD9787/AD9788 serial port is a flexible, synchronous serial communications port allowing easy interface to many industry-standard microcontrollers and microprocessors. The serial I/O is compatible with most synchronous transfer formats, including both the Motorola(R) 6905/11 SPI and the Intel(R) 8051 SSR protocols. The serial interface allows read/write access to all registers that configure the AD9785/AD9787/AD9788. MSB first and LSB first transfer formats are supported. In addition, the serial interface port can be configured as a single-pin I/O (SDIO), which allows a 3-wire interface, or two unidirectional pins for input/output (SDIO/SDO), which enables a 4-wire interface. One optional pin, SPI_CSB (chip select), allows enabling of multiple devices on a single bus. With the AD9785/AD9787/AD9788, the instruction byte specifies read/write operation and the register address. Serial operations on the AD9785/AD9787/AD9788 occur only at the register level, not at the byte level, due to the lack of byte address space in the instruction byte.
+ TXENABLE 16 P1D[15:0] 0 1 2 QUAD HB FILTER (2x) QUAD HB FILTER (2x) QUAD HB FILTER (2x) 3 3 2 1 0 +
x SIN(x)
0 1
16 16-BIT DAC1 I-SCALE 10 Q-SCALE 16-BIT DAC2 I-OFFSET
OUT1_P OUT1_N
DATA ASSEMBLER
16 COS 16 SIN
NCO
16 32 0 x SIN(x) 1
OUT2_P OUT2_N
GAIN1
+ +
16
GAIN2
P2D[15:0]
16
Q-OFFSET
INTERPOLATION FACTOR
REFERENCE AND BIAS
10
INV_SINC_EN
FREQUENCY
HB1_CLK
HB2_CLK
HB3_CLK
PHASE
PHASE CORRECTION
10
VREF RESET
10
AUX1
AUX1_P AUX1_N AUX2_P AUX2_N
INTERNAL CLOCK TIMING AND CONTROL LOGIC PLL CONTROL SERIAL I/O PORT 0 1 CLOCK MULTIPLIER (2x - 16x) CLK RCVR 10
DATACLK SYNC_O LVDS 1 0 LVDS
DELAY LINE DELAY LINE DELAY LINE PROGRAMMING REGISTERS POWER-ON RESET
AUX2
DAC_CLK
MULTICHIP SYNCHRONIZATION
REFCLK+ REFCLK-
SYNC_I
SPI_SDO SPI_SDIO SCLK SPI_CSB
PLL_LOCK
IRQ RESET
Figure 42. Functional Block Diagram
Rev. 0 | Page 21 of 64
07098-002
AD9785/AD9787/AD9788
There are two phases to a communication cycle with the AD9785/AD9787/AD9788. Phase 1 is the instruction cycle, which is the writing of an instruction byte into the AD9785/ AD9787/AD9788, coincident with the first eight SCLK rising edges. The instruction byte provides the AD9785/AD9787/ AD9788 serial port controller with information regarding the data transfer cycle, which is Phase 2 of the communication cycle. The instruction byte defines whether the upcoming data transfer is read or write and the serial address of the register being accessed. The first eight SCLK rising edges of each communication cycle are used to write the instruction byte into the AD9785/AD9787/ AD9788. The remaining SCLK edges are for Phase 2 of the communication cycle. Phase 2 is the actual data transfer between the AD9785/AD9787/AD9788 and the system controller. The number of bytes transferred during Phase 2 of the communication cycle is a function of the register being accessed. For example, when accessing the frequency tuning word (FTW) register, which is four bytes wide, Phase 2 requires that four bytes be transferred. If accessing the amplitude scale factor (ASF) register, which is three bytes wide, Phase 2 requires that three bytes be transferred. After transferring all data bytes per the instruction byte, the communication cycle is completed. At the completion of any communication cycle, the AD9785/ AD9787/AD9788 serial port controller expects the next eight rising SCLK edges to be the instruction byte of the next communication cycle. All data input is registered on the rising edge of SCLK. All data is driven out of the AD9785/AD9787/AD9788 on the falling edge of SCLK. Figure 43 through Figure 46 are useful in understanding the general operation of the AD9785/AD9787/AD9788 serial port.
INSTRUCTION CYCLE SPI_CSB DATA TRANSFER CYCLE
SCLK
R/W N1 N0 A4 A3 A2 A1 A0 D7 D6N D5N D3 0 D20 D10 D00
07098-006
SPI_SDIO
SPI_SDO
D7 D6N D5 N
D3 0 D20 D10 D00
Figure 43. Serial Register Interface Timing, MSB First
INSTRUCTION CYCLE SPI_CSB
DATA TRANSFER CYCLE
SCLK
SPI_SDIO SPI_SDO
A0
A1
A2
A3 A4
N0 N1 R/W D00 D10 D20
D4N D5N D6N D7 N
07098-007
D00 D10 D20
D4N D5 N D6N D7N
Figure 44. Serial Register Interface Timing, LSB First
tDS
SPI_CSB
tSCLK
tPWH
SCLK
tPWL
tDS
SPI_SDIO
INSTRUCTION BIT 7
INSTRUCTION BIT 6
Figure 45. SPI Register Write Timing
SPI_CSB
SCLK
07098-009
tDV
SPI_SDIO SPI_SDO DATA BIT n DATA BIT n-1
Figure 46. SPI Register Read Timing Instruction Byte
Rev. 0 | Page 22 of 64
07098-008
tDH
AD9785/AD9787/AD9788
Instruction Byte
The instruction byte contains the following information as shown in the instruction byte bit map.
SPI_SDO--Serial Data Output
Data is read from this pin for protocols that use separate lines for transmitting and receiving data. In the case where the AD9785/AD9787/AD9788 operate in a single bidirectional I/O mode, this pin does not output data and is set to a high impedance state.
Instruction Byte Information Bit Map
MSB D7 R/W D6 X D5 X D4 A4 D3 A3 D2 A2 D1 A1 LSB D0 A0
MSB/LSB Transfers
The AD9785/AD9787/AD9788 serial port can support both most significant bit (MSB) first or least significant bit (LSB) first data formats. This functionality is controlled by Bit 6 of the communication (COMM) register. The default value of COMM Register Bit 6 is low (MSB first). When COMM Register Bit 6 is set high, the serial port is in LSB first format. The instruction byte must be written in the format indicated by COMM Register Bit 6. That is, if the device is in LSB first mode, the instruction byte must be written from least significant bit to most significant bit. For MSB first operation, the serial port controller generates the most significant byte (of the specified register) address first, followed by the next lesser significant byte addresses until the I/O operation is complete. All data written to or read from the AD9785/AD9787/AD9788 must be in MSB first order. If the LSB mode is active, the serial port controller generates the least significant byte address first, followed by the next greater significant byte addresses until the I/O operation is complete. All data written to or read from the AD9785/AD9787/AD9788 must be in LSB first order.
R/W--Bit 7 of the instruction byte determines whether a read or write data transfer occurs after the instruction byte write. Logic 1 indicates a read operation. Logic 0 indicates a write operation. X, X --Bit 6 and Bit 5 of the instruction byte are don't care. In previous TxDACs, such as the AD9779, these bits define the number of registers written to or read from in an SPI read/write operation. In the AD9785/AD9787/AD9788, the register itself now defines how many bytes are written to or read from. A4, A3, A2, A1, A0--Bit 4, Bit 3, Bit 2, Bit 1, and Bit 0 of the instruction byte determine which register is accessed during the data transfer portion of the communication cycle.
Serial Interface Port Pin Description SCLK--Serial Clock
The serial clock pin is used to synchronize data to and from the AD9785/AD9787/AD9788 and to run the internal state machines. SCLK maximum frequency is 40 MHz.
SPI_CSB--Chip Select
Active low input that allows more than one device on the same serial communications line. The SPI_SDO and SPI_SDIO pins go to a high impedance state when this input is high. If driven high during any communication cycle, that cycle is suspended until SPI_CSB is reactivated low. Chip select can be tied low in systems that maintain control of SCLK.
SPI Resynchronization Capability
If the SPI port becomes unsynchronized at any time, toggling SCLK for eight or more cycles with SPI_CSB held high resets the SPI port state machine. The device is then ready for the next register read or write access.
SPI_SDIO--Serial Data I/O
Data is always written into the AD9785/AD9787/AD9788 on this pin. However, this pin can be used as a bidirectional data line. Bit 7 of Register 0x00 controls the configuration of this pin. The default is Logic 0, which configures the SPI_SDIO pin as bidirectional.
Rev. 0 | Page 23 of 64
AD9785/AD9787/AD9788 SPI REGISTER MAP
When reading Table 9, note that the AD9785/AD9787/AD9788 is a 32-bit part and, therefore, the 4th through the 11th columns (beginning with the MSB and ending with the LSB) represent a set of eight bits. Refer to the Bit Range column for the actual bits being described. Table 9.
Address 0x00 Register Name Comm. (COMM) Register Digital Control Register Bit Range [7:0] MSB MSB - 1 SPI_SDIO LSB first bidirectional (active high, 3-wire) Interpolation Factor [1:0] MSB - 2 Software reset MSB - 3 Powerdown mode Singleport mode Sync mode select DATACLK delay enable MSB - 4 Auto powerdown enable Real mode Pulse sync enable Data timing mode MSB - 5 I/O transfer (selfreset) IQ select invert Spectral inversion Set low MSB - 6 Automatic I/O transfer enable Q first LSB Open Default 0x02
0x01
[7:0]
Data format PN code sync enable DATACLK invert
[15:8]
Reserved
Clear phase accumulator LVDS data clock enable
0x02
Data Sync Control Register Multichip Sync Control Register
[7:0]
Data Timing Margin [0]
Inverse sinc enable Data sync polarity
Modulator gain control DATACLK output enable Reserved
0x00
0x31
0x00
0x03
[15:8] [7:0] [15:8]
[23:16]
[31:24] 0x04 PLL Control Register I DAC Control Register Auxiliary DAC 1 Control Register Q DAC Control Register Auxiliary DAC 2 Control Register Interrupt Control Register [7:0] [15:8] [23:16] [7:0] [15:8] [7:0] [15:8]
0x05
0x06
0x07
[7:0] [15:8] [7:0] [15:8]
0x08
0x09
[7:0]
[15:8]
0x0A
Frequency Tuning Word Register
[31:0]
Data Timing Margin [3:1] Sync Timing Margin [3:0] SYNC_O Sync Set high polarity loopback enable Set low DATACLK SYNC_I Delay [4:0] Sync input error check mode Correlate Threshold [4:0] SYNC _I SYNC _O Set low enable enable PLL Band Select [5:0] PLL VCO Drive [1:0] PLL enable PLL VCO Divisor [1:0] PLL Loop Divisor [1:0] PLL Bias [2:0] VCO Control Voltage [2:0] PLL Loop Bandwidth [4:0] I DAC Gain Adjustment [7:0] I DAC sleep I DAC Reserved I DAC Gain Adjustment power-down [9:8] Auxiliary DAC 1 Data [7:0] Reserved Auxiliary DAC 1 Data Auxiliary Auxiliary Auxiliary [9:8] DAC 1 DAC 1 sign DAC 1 powercurrent down direction Q DAC Gain Adjustment [7:0] Q DAC sleep Q DAC Reserved Q DAC Gain Adjustment power-down [9:8] Auxiliary DAC 2 Data [7:0] Reserved Auxiliary DAC 2 Data Auxiliary Auxiliary Auxiliary [9:8] DAC 2 DAC 2 sign DAC 2 powercurrent down direction PLL lock Reserved Data port Sync port Sync Data timing Sync timing Data indicator IRQ enable IRQ timing error IRQ error IRQ timing enable error error type type Sync lock Reserved Reserved Clear lock Sync status lock indicator lost (selfstatus reset) Frequency Tuning Word [31:0]
DATACLK Delay [4:0] Clock State [3:0] SYNC _O Delay [4:0]
0x00 0x00 0x00
0x00
0x80 0xCF 0x37 0x38 0xF9 0x01 0x00 0x00
0xF9 0x01 0x00 0x00
0x00
0x00
0x00
Rev. 0 | Page 24 of 64
AD9785/AD9787/AD9788
Address 0x0B Register Name Phase Control Register Bit Range [15:0] [23:16] [31:24] 0x0C Amplitude Scale Factor Register [7:0] [15:8] MSB MSB - 1 MSB - 2 MSB - 3 MSB - 4 NCO Phase Offset Word [15:0] Phase Correction Word [7:0] Reserved I DAC Amplitude Scale Factor [7:0] Q DAC Amplitude Scale Factor [6:0] MSB - 5 MSB - 6 LSB Default 0x00 0x00 0x00 0x80 0x00
Phase Correction Word [9:8] I DAC Amplitude Scale Factor [8] Q DAC Amplitude Scale Factor [8:7]
[23:16] 0x0D Output Offset Register Version Register RAM Test Register [15:0] [31:16] [7:0] [15:8] [31:0] [31:0]
Reserved I DAC Offset [15:0] Q DAC Offset [15:0] Version ID Reserved RAM Test
0x01 0x00 0x00
0x0E 1 0x1D1 0x1E
1
Address space between Address 0x0E and Address 0x1D is intentionally left open.
SPI REGISTER DESCRIPTIONS
The communication (COMM) register comprises one byte located at Address 0x00. Table 10. Communication (COMM) Register
Address 0x00 Bit [7] [6] [5] Name SPI_SDIO bidirectional LSB first Software reset Description 0: Default. Use the SPI_SDIO pin for input data only, 4-wire serial mode. 1: Use SPI_SDIO as a read/write pin, 3-wire serial mode. 0: Default. MSB first format is active. 1: Serial interface accepts serial data in LSB first format. 0: Default. Bit is in the inactive state. 1: In the AD9785/AD9787/AD9788, all programmable bits return to their power-up state except for the COMM register bits, which are unaffected by the software reset. The software reset remains in effect until this bit is set to 0 (inactive state). 0: Default. The full chip power-down is not active. 1: The AD9785/AD9787/AD9788 enter a power-down mode in which all functions are powered down. This power-down puts the part into its lowest possible power dissipation state. The part remains in this low power state until the user sets this bit to a Logic 0. The analog circuitry requires 250 ms to become operational. 0: Default. Inactive state, automatic power-down feature is not enabled. 1: The device automatically switches into its low power mode whenever TXENABLE is deasserted for a sufficiently long period of time. 0: Default. Inactive state. 1: The contents of the frequency tuning word memory buffer, phase control memory buffer, amplitude scale factor memory buffer, and the output offset memory buffer are moved to a memory location that affects operation of the device. The one-word memory buffer is employed to simultaneously update the NCO frequency, phase, amplitude, and offset control. Note that this bit automatically clears itself after the I/O transfer occurs. For this reason, unless the reference clock is stopped, it is difficult to read back a Logic 1 on this bit. 0: Automatic I/O transfer disabled. The I/O transfer bit (Bit 2) must be set to update the device in the event that changes have been made to Register 0x0A, Register 0x0B, Register 0x0C, or Register 0x0D. This allows the user to change important operating modes of the device all at once, rather than one at a time with individual SPI writes. 1: Default. Automatic I/O transfer enabled. The device updates its operation immediately when SPI writes are completed to Register 0x0A, Register 0x0B, Register 0x0C, or Register 0x0D.
[4]
Power-down mode
[3]
Auto power-down enable I/O transfer (self-reset)
[2]
[1]
Automatic I/O transfer enable
Rev. 0 | Page 25 of 64
AD9785/AD9787/AD9788
The digital control (DCTL) register comprises two bytes located at Address 0x01. Table 11. Digital Control (DCTL) Register
Address 0x01 Bit [15] [14] Name Reserved Clear phase accumulator PN code sync enable Sync mode select Pulse sync enable Spectral inversion Description Reserved for future use. 0: Default. The feature that clears the NCO phase accumulator is inactive. The phase accumulator operates as normal. 1: The NCO phase accumulator is held in the reset state until this bit is cleared. 0: PN code synchronization mode is disabled. 1: PN code synchronization mode is enabled. See the Device Synchronization section for details. 0: Selects pulse mode synchronization. 1: Selects PN code synchronization. See the Device Synchronization section for details. 0: Pulse mode synchronization is disabled. 1: Pulse mode synchronization is enabled. See the Device Synchronization section for details. 0: The modulator outputs high-side image. 1: The modulator outputs low-side image. The image is spectrally inverted compared to the input data. 0: Default. The inverse sinc filter is bypassed. 1: The inverse sinc filter is enabled and operational. 0: Data clock pin is disabled. 1: Default. The output data clock pin is active (configured as an output). Specifies the filter interpolation rate where: 00: 1x interpolation 01: 2x interpolation 10: 4x interpolation 11: 8x interpolation 0: Default. The incoming data is expected to be twos complement. 1: The incoming data is expected to be offset binary. 0: Default. When the single-port bit is cleared, I/Q data is sampled simultaneously on the P1D and P2D input ports. Specifically, I data is registered from the P1D[15:0] pins and Q data is registered from the P2D[15:0] pins. 1: When the single-port bit is set, I/Q data is sampled in a serial word fashion on the P1D input port. In this mode, the I/Q data is sampled into the part at twice the I/Q sample rate. 0: Default. Logic 0 is the inactive state for this bit. 1: When the real mode bit is set, the Q path logic after modulation and phase compensation is disabled. 0: Default. When the IQ Select Invert bit is cleared, a Logic 1 on the TXENABLE pin indicates I data, and a Logic 0 on the TXENABLE pin indicates Q data, if the user is employing a continuous timing style on the TXENABLE pin. 1: When the IQ Select Invert bit is set, a Logic 1 on the TXENABLE pin indicates Q data, and a Logic 0 on the TXENABLE pin indicates I data, if the user is employing a continuous timing style on the TXENABLE pin. 0: Default. When the Q first bit is cleared, the I/Q data pairing is nominal, that is, the I data precedes the Q data in the assembly of the I/Q data pair. As such, data input to the device as I0, Q0, I1, Q1 . . . In, Qn is paired as follows: (I0/Q0), (I1/Q1) ... (In/Qn). 1: When the Q first bit is set, the I/Q data pairing is altered such that the I data is paired with the previous Q data. As such, data input to the device as I0, Q0, I1, Q1, I2, Q2, I3, Q3 . . . In, Qn is paired as follows: (I1/Q0), (I2/Q1), (I3/Q2) ... (In + 1/Qn). 0: Default. No gain scaling is applied to the NCO input to the internal digital modulator. 1: Gain scaling of 0.5 is applied to the NCO input to the modulator. This can eliminate saturation of the modulator output for some combinations of data inputs and NCO signals.
[13]
[12] [11] [10]
[9] [8] [7:6]
Inverse sinc enable DATACLK output enable Interpolation Factor [1:0]
[5] [4]
Data format Single-port mode
[3]
Real mode
[2]
IQ select invert
[1]
Q first (data pairing)
[0]
Modulator gain control
Rev. 0 | Page 26 of 64
AD9785/AD9787/AD9788
The data synchronization control register (DSCR) comprises two bytes located at Address 0x02. Table 12. Data Synchronization Control Register (DSCR)
Address 0x02 Bit [15:11] Name DATACLK Delay [4:0] Description Controls the amount of delay applied to the output data clock signal. The minimum delay corresponds to the 00000 state, and the maximum delay corresponds to the 11111 state. The minimum delay is 0.7 ns and the maximum delay is 6.5 ns. The incremental delay is 190 ps and corresponds to an incremental change in the data clock delay bits. The data timing margin bits control the amount of delay applied to the data and clock signals used for checking setup and hold times, respectively, on the input data ports, with respect to the internal data assembler clock. The minimum delay corresponds to the 0000 state, and the maximum delay corresponds to the 1111 state. The delays are 190 ps. 0: Default. When the LVDS data clock enable bit is cleared, the SYNC_O+ and SYNC_O- LVDS pad cells are driven by the multichip synchronization logic. 1: When the LVDS data clock enable bit is set, the SYNC_O+ and SYNC_O- LVDS pad cells are driven by the signal that drives the CMOS DATACLK output pad. 0: Default. When the data clock invert bit is cleared, the DATACLK signal is in phase with the clock that samples the data into the part. 1: When the DATACLK invert bit is set, the DATACLK signal is inverted from the clock that samples the data into the part. 0: Default. When the DATACLK delay enable bit is cleared, the data port input synchronization function is effectively inactive and the delay is bypassed. 1: When the DATACLK delay enable bit is set, the data port input synchronization function is active and controlled by the data delay mode bits. The data output clock is routed through the delay cell. Determines the timing optimization mode. See the Optimizing the Data Input Timing section for details. 0: Manual timing optimization mode 1: Automatic timing optimization mode This bit should always be set low. 0: Default. The digital input data sampling edge is aligned with the falling edge of DCI. 1: The digital input data sampling edge is aligned with the rising edge of DCI. Used only in slave mode (see the MSCR register, Address 0x03, Bit 16). Reserved for future use.
[10:7]
Data Timing Margin [3:0]
[6]
LVDS data clock enable
[5]
DATACLK invert
[4]
DATACLK delay enable
[3]
Data timing mode
[2] [1]
Set low Data sync polarity
[0]
Reserved
Rev. 0 | Page 27 of 64
AD9785/AD9787/AD9788
The multichip synchronization register (MSCR) comprises four bytes located at Address 0x03. Table 13. Multichip Synchronization Register (MSCR)
Address 0x03 Bit [31:27] Name Correlate Threshold [4:0] SYNC_I enable SYNC_O enable Set low SYNC_I Delay [4:0] Sync error check mode Description Sets the threshold for determining if the received synchronization data can be demodulated accurately. A smaller threshold value makes the demodulator more noise immune; however, the system becomes more susceptible to false locks (or demodulation errors). 0: Default. The synchronization receive logic is disabled. 1: The synchronization receive logic is enabled. 0: Default. The output synchronization pulse generation logic is disabled. 1: The output synchronization pulse generation logic is enabled. This bit should always be set low. These bits are the input synchronization pulse delay word. These bits are don't care if the synchronization driver enable bit is cleared. Specifies the synchronization pulse error check mode. 0: Manual error check 1: Automatic continuous error check This bit should always be set low. 0: Default. Slave mode is disabled. 1: Slave mode is enabled. Pin 37 functions as an input for the DATACLK signal, called DCI (DATACLK input) in this mode. Depending on the state of Bit 1 in the DSCR register (Address 0x02), the sampling edge (where the data is latched into the AD9785/AD9787/AD9788) can be programmed to be aligned with either the rising or falling edge of DCI. This mode can only be used with 4x or 8x interpolation. These bits are the output synchronization pulse delay word. These bits control the DAC sample rate clock to output the delay time of the synchronization pulse. These bits are don't care if the synchronization driver enable bit is cleared. This bit should always be set high. 0: Default. SYNC_O changes state on the rising edge of DACCLK. 1: SYNC_O is generated on the falling edge of DACCLK. 0: Default. The AD9785/AD9787/AD9788 are not operating in internal loopback mode. 1: If the SYNC_O enable and Sync loopback enable bits are set, the AD9785/AD9787/AD9788 are operating in a mode in which the internal synchronization pulse of the device is used at the multichip receiver logic and the SYNC_I+ and SYNC_I- input pins are ignored. For proper operation of the loopback synchronization mode, the synchronization driver enable and sync enable bits must be set. This value determines the state of the internal clock generation state machine upon synchronization. These bits are the synchronization window delay word. These bits are don't care if the synchronization driver enable bit is cleared.
[26] [25] [24] [23:19] [18]
[17] [16]
Set low DATACLK input
[15:11]
SYNC_O Delay [4:0]
[10] [9] [8]
Set high SYNC_O polarity Sync loopback enable
[7:4] [3:0]
Clock State [3:0] Sync Timing Margin [3:0]
Rev. 0 | Page 28 of 64
AD9785/AD9787/AD9788
The PLL control (PLLCTL) register comprises three bytes located at Address 0x04. These bits are routed directly to the periphery of the digital logic. No digital functionality within the main digital block is required. Table 14. PLL Control (PLLCTL) Register
Address 0x04 Bit [23:21] [20:16] [15] Name VCO Control Voltage [2:0] PLL Loop Bandwidth [4:0] PLL enable Description 000 to 111, proportional to voltage at VCO, control voltage input (readback only). A value of 011 indicates that the VCO control voltage is centered. These bits control the bandwidth of the PLL filter. Increasing the value lowers the loop bandwidth. Set to 01111 for optimal performance. 0: Default. With PLL off, the DAC sample clock is sourced directly by the REFCLK input. 1: With PLL on, the DAC clock is synthesized internally from the REFCLK input via the PLL clock multiplier. See the Clock Multiplication section for details. Sets the value of the VCO output divider, which determines the ratio of the VCO output frequency to the DAC sample clock frequency, fVCO/fDACCLK. 00: fVCO/fDACCLK = 1 01: fVCO/fDACCLK = 2 10: fVCO/fDACCLK = 4 11: fVCO/fDACCLK = 8 Sets the value of the DACCLK divider, which determines the ratio of the DAC sample clock frequency to the REFCLK frequency, fDACCLK/fREFCLK. 00: fDACCLK/fREFCLK = 2 01: fDACCLK/fREFCLK = 4 10: fDACCLK/fREFCLK = 8 11: fDACCLK/fREFCLK = 16 These bits control the VCO bias current. Set to 011 for optimal performance. These bits set the operating frequency of the VCO. For further details, refer to Table 35. These bits control the signal strength of the VCO output. Set to 11 for optimal performance.
[14:13]
PLL VCO Divisor [1:0]
[12:11]
PLL Loop Divisor [1:0]
[10:8] [7:2] [1:0]
PLL Bias [2:0] PLL Band Select [5:0] PLL VCO Drive [1:0]
The I DAC control register comprises two bytes located at Address 0x05. These bits are routed directly to the periphery of the digital logic. No digital functionality within the main digital block is required. Table 15. I DAC Control Register
Address 0x05 Bit [15] [14] [13:10] [9:0] Name I DAC sleep I DAC power-down Reserved I DAC gain adjustment Description 0: Default. If the I DAC sleep bit is cleared, the I DAC is active. 1: If the I DAC sleep bit is set, the I DAC is inactive and enters a low power state. 0: Default. If the I DAC power-down bit is cleared, the I DAC is active. 1: If the I DAC power-down bit is set, the I DAC is inactive and enters a low power state. Reserved for future use. These bits are the I DAC gain adjustment bits.
Rev. 0 | Page 29 of 64
AD9785/AD9787/AD9788
The Auxiliary DAC 1 control register comprises two bytes located at Address 0x06. These bits are routed directly to the periphery of the digital logic. No digital functionality within the main digital block is required. Table 16. Auxiliary DAC 1 Control Register
Address 0x06 Bit [15] Name Auxiliary DAC 1 sign Description 0: Default. If the Auxiliary DAC 1 sign bit is cleared, the Aux DAC 1 sign is positive. Pin 90 is the active pin. 1: If the Auxiliary DAC 1 sign bit is set, the Aux DAC 1 sign is negative. Pin 89 is the active pin. 0: Default. If the Auxiliary DAC 1 current direction bit is cleared, the Aux DAC 1 sources current. 1: If the Auxiliary DAC 1 current direction bit is set, the Aux DAC 1 sinks current. 0: Default. If the Auxiliary DAC 1 power-down bit is cleared, the Aux DAC 1 is active. 1: If the Auxiliary DAC 1 power-down bit is set, the Aux DAC 1 is inactive and enters a low power state. Reserved for future use. These bits are the Auxiliary DAC 1 gain adjustment bits.
[14]
Auxiliary DAC 1 current direction Auxiliary DAC 1 power-down Reserved Auxiliary DAC 1 data
[13]
[12:10] [9:0]
The Q DAC control register comprises two bytes located at Address 0x07. These bits are routed directly to the periphery of the digital logic. No digital functionality within the main digital block is required. Table 17. Q DAC Control Register
Address 0x07 Bit [15] [14] [13:10] [9:0] Name Q DAC sleep Q DAC power-down Reserved Q DAC gain adjustment Description 0: Default. If the Q DAC sleep bit is cleared, the Q DAC is active. 1: If the Q DAC sleep bit is set, the Q DAC is inactive and enters a low power state. 0: Default. If the Q DAC power-down bit is cleared, the Q DAC is active. 1: If the Q DAC power-down bit is set, the Q DAC is inactive and enters a low power state. Reserved for future use. These bits are the Q DAC gain adjustment bits.
The Auxiliary DAC 2 control register comprises two bytes located at Address 0x08. These bits are routed directly to the periphery of the digital logic. No digital functionality within the main digital block is required. Table 18. Auxiliary DAC 2 Control Register
Address 0x08 Bit [15] Name Auxiliary DAC 2 sign Description 0: Default. If the Auxiliary DAC 2 sign bit is cleared, the Aux DAC 2 sign is positive. Pin 86 is the active pin. 1: If the Auxiliary DAC 2 sign bit is set, the Aux DAC 2 sign is negative. Pin 87 is the active pin. 0: Default. If the Auxiliary DAC 2 current direction bit is cleared, the Aux DAC 2 sources current. 1: If the Auxiliary DAC 2 current direction bit is set, the Aux DAC 2 sinks current. 0: Default. If the Auxiliary DAC 2 power-down bit is cleared, the Aux DAC 2 is active. 1: If the Auxiliary DAC 2 power-down bit is set, the Aux DAC 2 is inactive and enters a low power state. Reserved for future use. These bits are the Auxiliary DAC 2 gain adjustment bits.
[14]
Auxiliary DAC 2 current direction Auxiliary DAC 2 power-down Reserved Auxiliary DAC 2 data
[13]
[12:10] [9:0]
Rev. 0 | Page 30 of 64
AD9785/AD9787/AD9788
The interrupt control register comprises two bytes located at Address 0x09. Bits [11:10] and Bits [7:3] are read-only bits that indicate the current status of a specific event that may cause an interrupt request (IRQ pin active low). These bits are controlled via the digital logic and are read only via the serial port. Bits [1:0] are the IRQ mask (or enable) bits, which are writable by the user and can also be read back. Table 19. Interrupt Control Register
Address 0x09 Bit [15:13] [12] [11] Name Reserved Clear lock indicator Sync lock lost status Description Reserved for future use. Writing a 1 to this bit clears the sync lock lost status bit. This bit does not automatically reset itself to 0 when the reset is complete. When high, this bit indicates that the device has lost synchronization. This bit is latched and does not reset automatically after the device regains synchronization. To reset this bit to 0, a 1 must be written to the clear lock indicator bit. When this bit is low, the device is not synchronized. When this bit is high, the device is synchronized. Reserved for future use. 0: Default. No setup or hold time error has been detected via the input data port setup/hold error checking logic. 1: A setup or hold time error has been detected via the input data port setup/hold error checking logic. 0: Default. No setup or hold time error has been detected via the multichip synchronization receive pulse setup/hold error checking logic. 1: A setup or hold time error has been detected via the multichip synchronization receive pulse setup/hold error checking logic. 0: Default. A hold error has been detected via the input data port setup/hold error checking logic. This bit is valid only if the data timing error IRQ bit (Bit 7) is set. 1: A setup error has been detected via the input data port setup/hold error checking logic. This bit is valid only if the data timing error IRQ bit (Bit 7) bit is set. 0: Default. A hold error has been detected via the multichip synchronization receive pulse setup/hold error checking logic. This bit is valid only if the sync timing error IRQ bit (Bit 6) is set. 1: A setup error has been detected via the multichip synchronization receive pulse setup/hold error checking logic. This bit is valid only if the sync timing error IRQ bit (Bit 6) is set. 0: Default. The PLL clock multiplier is not locked to the input reference clock. 1: The PLL clock multiplier is locked to the input reference clock. Reserved for future use. 0: Default. The data IRQ bit (and the IRQ pin) are not enabled (masked) for any errors that may be detected via the input data port setup/hold error checking logic. 1: The data IRQ bit (and the IRQ pin) are enabled and go active if a setup or hold error is detected via the input data port setup/hold error checking logic. 0: Default. The sync IRQ bit (and the IRQ pin) are not enabled (masked) for any errors that may be detected via the multichip synchronization receive pulse setup/hold error checking logic. 1: The sync IRQ bit (and the IRQ pin) are enabled and go active if a setup or hold error is detected via the multichip synchronization receive pulse setup/hold error checking logic.
[10] [9:8] [7]
Sync lock status Reserved Data timing error IRQ
[6]
Sync timing error IRQ
[5]
Data timing error type
[4]
Sync timing error type
[3] [2] [1]
PLL lock indicator Reserved Data port IRQ enable
[0]
Sync port IRQ enable
Rev. 0 | Page 31 of 64
AD9785/AD9787/AD9788
The frequency tuning word (FTW) register comprises four bytes located at Address 0x0A. Table 20. Frequency Tuning Word (FTW) Register
Address 0x0A Bit [31:0] Name Frequency Tuning Word [31:0] Description These bits make up the frequency tuning word applied to the NCO phase accumulator. See the Numerically Controlled Oscillator section for details.
The phase control register (PCR) comprises four bytes located at Address 0x0B. Table 21. Phase Control Register (PCR)
Address 0x0B Bit [31:26] [25:16] [15:0] Name Reserved Phase Correction Word [9:0] NCO Phase Offset Word [15:0] Description Reserved for future use. These bits are the 10-bit phase correction word. These bits are the 16-bit NCO phase offset word. See the Numerically Controlled Oscillator section for details.
The amplitude scale factor (ASF) register comprises three bytes located at Address 0x0C. Table 22. Amplitude Scale Factor (ASF) Register
Address 0x0C Bit [23:18] [17:9] [8:0] Name Reserved Q DAC Amplitude Scale Factor [8:0] I DAC Amplitude Scale Factor [8:0] Description Reserved for future use. These bits are the 9-bit Q DAC amplitude scale factor. The bit weighting is MSB = 21, LSB = 2-7, which yields a multiplier range of 0 to 3.9921875. These bits are the 9-bit I DAC amplitude scale factor. The bit weighting is MSB = 21, LSB = 2-7, which yields a multiplier range of 0 to 3.9921875.
The output offset (OOF) register comprises four bytes located at Address 0x0D. Table 23. Output Offset (OOF) Register
Address 0x0D Bit [31:16] [15:0] Name Q DAC Offset [15:0] I DAC Offset [15:0] Description These bits are the 16-bit Q DAC offset factor. The LSB bit weight is 20. These bits are the 16-bit I DAC offset factor. The LSB bit weight is 20.
The version register (VR) comprises two bytes located at Address 0x0E and is read only. Table 24. Version Register (VR)
Address 0x0E Bit [15:8] [7:0] Name Reserved Version ID Description Reserved for future use. These bits read back the current version of the product.
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AD9785/AD9787/AD9788 INPUT DATA PORTS
The AD9785/AD9787/AD9788 can operate in two data input modes: dual-port mode and single-port mode. In the default dual-port mode (single-port mode = 0), each DAC receives data from a dedicated input port. In single-port mode (single-port mode = 1), both DACs receive data from Port 1. In single-port mode, DAC 1 and DAC 2 data is interleaved and the TXENABLE input is used to steer data to the intended DAC. In dual-port mode, the TXENABLE input is used to power down the digital datapath. In dual-port mode, the data must be delivered at the input data rate. In single-port mode, data must be delivered at twice the input data rate of each DAC. Because the data inputs function up to a maximum of 300 MSPS, it is only practical to operate with input data rates up to 150 MHz per DAC in single-port mode. In both dual-port and single-port modes, a data clock output (DATACLK) signal is available as a fixed-time base with which to drive data from an FPGA (field programmable gate array) or from another data source. This output signal operates at the input data rate. The DATACLK pin can operate as either an input or an output. The Q first bit (Register 0x01, Bit 1) controls the pairing order of the input data. With the Q first bit set to the default of 0, the I/Q pairing sent to the DACs is the two input datawords corresponding to TXENABLE low followed by TXENABLE high. With the Q first bit set to 1, the I/Q pairing sent to the DACs is the two input data-words corresponding to TXENABLE high followed by TXENABLE low. Note that with Q first set, the I data still corresponds to the TXENABLE high word and the Q data corresponds to the TXENABLE low word and only the pairing order changes.
DUAL-PORT MODE
In dual-port mode, data for each DAC is received on the respective input bus (P1D[15:0] or P2D[15:0]). I and Q data arrive simultaneously and are sampled on the rising edge of an internal sampling clock (SMP_CLK) that is synchronous with DATACLK.
INPUT DATA REFERENCED TO DATACLK
The simplest method of interfacing to the AD9785/AD9787/ AD9788 is when the input data is referenced to the DATACLK output. The DATACLK output is phase-locked (with some offset) to the internal clock that is used to latch the input data. Therefore, if the setup and hold times of the input data with respect to DATACLK are met, the interface timing latches in the data correctly. Table 25 shows the setup and hold time requirements for the input data over the operating temperature range of the device. Table 25 also shows the data valid window (DVW). The data valid window is the sum of the setup and hold times of the interface. This is the minimum amount of time valid data must be presented to the device in order to ensure proper sampling.
SINGLE-PORT MODE
In single-port mode, data for both DACs is received on the Port 1 input bus (P1D[15:0]). I and Q data samples are interleaved and are latched on the rising edges of DATACLK. Accompanying the data is the TXENABLE (Pin 39) input signal, which steers incoming data to its respective DAC. When TXENABLE is high, the corresponding data-word is sent to the I DAC and, when TXENABLE is low, the corresponding data is sent to the Q DAC. The timing of the digital interface in interleaved mode is shown in Figure 48.
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AD9785/AD9787/AD9788
DATACLK
INPUT DATA
Figure 47. DATACLK Timing
DATACLK P1D[15:0] TXENABLE SMP_CLK P1D_SMP[15:0] IQSEL_SMP QFIRST = 0 I DAC[15:0] Q DAC[15:0] QFIRST = 1 I DAC[15:0] Q DAC[15:0]
P1D(1) P1D(2) P1D(3) P1D(4) P1D(5) P1D(6) P1D(1) P1D(2) P1D(3) P1D(4) P1D(5) P1D(6) P1D(7) P1D(8) P1D(1) P1D(2) P1D(3) P1D(4) P1D(5) P1D(6) P1D(7) P1D(8)
P1D(4)
P1D(6)
Figure 48. Single-Port (Interleaved) Mode Digital Interface Timing
Table 25. Data Timing Specifications vs. Temperature
Timing Parameter Data with respect to REFCLK Temperature -40C +25C +85C -40C to +85C -40C +25C +85C -40C to +85C -40C +25C +85C -40C to +85C Min tS (ns) -0.25 -0.45 -0.6 -0.25 3.7 4.2 4.6 4.6 0.45 0.3 0.2 0.45 Min tH (ns) 1.7 2.1 2.4 2.4 -1.5 -1.8 -2.0 -1.5 -0.1 0.1 0.25 0.25 Min DVW (ns) 1.45 1.65 1.8 2.15 2.2 2.4 2.6 3.1 0.35 0.4 0.45 0.7
Data with respect to DATACLK
SYNC_I with respect to REFCLK
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P1D(1)
P1D(3)
P1D(5)
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tSDATACLK
tHDATACLK
AD9785/AD9787/AD9788
Setting the Frequency of DATACLK
The DATACLK signal is derived from the internal DAC sample clock, DACCLK. The frequency of DATACLK output depends on several programmable settings. The relationship between the frequency of DACCLK and DATACLK is
INPUT DATA REFERENCED TO REFCLK
In some systems, it may be more convenient to use the REFCLK input instead of the DATACLK output as the input data timing reference. If the frequency of DACCLK is equal to the frequency of the data input (PLL is bypassed and no interpolation is used), the timing parameter "Data with respect to REFCLK" shown in Table 25 applies directly without further considerations. If the frequency of DACCLK is greater than the frequency of the data input, a divider is used to generate the internal data sampling clock (DCLK_SMP). This divider creates a phase ambiguity between REFCLK and DCLK_SMP, which, in turn, causes a sampling time uncertainty. To establish fixed setup and hold times for the data interface, this phase ambiguity must be eliminated. To eliminate the phase ambiguity, the SYNC_I input pins (Pin 13 and Pin 14) must be used to synchronize the data to a specific DCLK_SMP phase. The specific steps for accomplishing this are detailed in the Device Synchronization section. The timing relationships between SYNC_I, DACCLK, REFCLK, and the input data are shown in Figure 49 through Figure 51.
f DATACLK =
f DACCLK IF x P
where the variables have the values shown in Table 26. Table 26. DACCLK to DATACLK Divisor Values
Variable IF P Value Interpolation factor 0.5 (if single port is enabled) 1 (if dual port is selected) Address Register Bits 0x01 [7:6] 0x01 [4]
SYNC_I
tH_SYNC tS_SYNC
DACCLK
REFCLK
tSREFCLK
INPUT DATA
tHREFCLK
Figure 49. REFCLK 2x
SYNC_I
tH_SYNC tS_SYNC
DACCLK
REFCLK
tSREFCLK
INPUT DATA
tHREFCLK
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Figure 50. REFCLK 4x
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AD9785/AD9787/AD9788
SYNC_I
tH_SYNC tS_SYNC
DACCLK
REFCLK
INPUT DATA
Figure 51. REFCLK 8x
OPTIMIZING THE DATA INPUT TIMING
The AD9785/AD9787/AD9788 have on-chip circuitry that enables the user to optimize the input data timing by adjusting the relationship between the DATACLK output and DCLK_SMP, the internal clock that samples the input data. This optimization is made by a sequence of SPI register read and write operations. The timing optimization can be done under strict control of the user, or the device can be programmed to maintain a configurable timing margin automatically. Figure 52 shows the circuitry that detects sample timing errors and adjusts the data interface timing. The DCLK_SMP signal is the internal clock used to latch the input data. Ultimately, it is the rising edge of this signal that must be centered in the valid sampling period of the input data. This is accomplished by adjusting the time delay, tD, which changes the DATACLK timing and, as a result, the arrival time of the input data with respect to DCLK_SMP.
tM DATA TIMING MARGIN[3:0] PD1[0] D Q TIMING ERROR DETECTION TIMING ERROR IRQ TIMING ERROR TYPE
The Data Timing Margin [3:0] variable (Register 0x02, Bits [10:7]) determines the amount of time before and after the actual data sampling point the margin test data are latched. That is, the Data Timing Margin [3:0] variable determines how much setup and hold margin the interface needs for the data timing error IRQ to remain inactive (to show error-free operation). Therefore, the data timing error IRQ is set whenever the setup and hold margins drop below the Data Timing Margin [3:0] value. This does not necessarily indicate that the data latched into the device is incorrect. In addition to setting the data timing error IRQ, the data timing error type bit (Register 0x09, Bit 5) is set when an error occurs. The data timing error bit is set low to indicate a hold error and high to indicate a setup error. Figure 53 shows a timing diagram of the data interface and the status of the data timing error type bit.
DATA TIMING ERROR = 0
CLK
DATA TIMING ERROR = 1, DATA TIMING ERROR TYPE = 1
D tM
Q
CLK
DATA tM tM DATA TIMING ERROR = 1, DATA TIMING ERROR TYPE = 0
DATACLK DELAY[4:0] DCLK_SMP DATACLK
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tD
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tSREFCLK
tHREFCLK
Figure 52. Timing Error Detection and Optimization Circuitry
DELAYED DATA SAMPLING
The error detection circuitry works by creating two sets of sampled data (referred to as the margin test data) in addition to the actual sampled data used in the device datapath. One set of sampled data is latched before the actual data sampling point. The other set of sampled data is latched after the actual data sampling point. If the margin test data matches the actual data, the sampling is considered valid and no error is declared. If there is a mismatch between the actual data and the margin test data, an error is declared.
ACTUAL SAMPLING INSTANT
DELAYED CLOCK SAMPLING
Figure 53. Timing Diagram of Margin Test Data
Automatic Timing Optimization Mode
When the automatic timing optimization mode is enabled (Register 0x02, Bit 3 = 1), the device continuously monitors the timing error IRQ and timing error type bits. The DATACLK Delay [4:0] value (Register 0x02, Bits [4:0]) increases if a setup error is detected and decreases if a hold error is detected. The value of the DATACLK Delay [4:0] setting currently in use can be read back by the user.
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Manual Timing Optimization Mode
When the device is operating in manual timing optimization mode (Register 0x02, Bit 3 = 0), the device does not alter the DATACLK Delay [4:0] value that is programmed by the user. By default, the DATACLK delay enable is inactive. This bit must be set high for the DATACLK Delay [4:0] value to be realized. The delay (in absolute time) when programming the DATACLK delay from 00000 to 11111 varies from about 700 ps to about 6.5 ns. Typical delays per increment over temperature are shown in Table 27. Table 27. Data Delay Line Typical Delays over Temperature
Delay Zero code delay (delay upon enabling delay line) Average unit delay -40C 630 175 +25C 700 190 +85C 740 210 Unit ps ps
The data can be written to the RAM in either LSB first or MSB first format. To write to the RAM in MSB first format, complete the following steps: 1. 2. Set Bit 6 of Register 0x00 to 0. Apply an instruction byte of 0xEE followed by the data to be stored.
In manual mode, the error checking logic is activated and generates an interrupt if a setup/hold violation is detected. One error check operation is performed per device configuration. Any change to the Data Timing Margin [3:0] or DATACLK Delay [4:0] values triggers a new error check operation.
After the instruction byte (a write to Register 0x1D) is received, the device automatically generates the addresses required to write the RAM, starting at the most significant address. The 32 rising SCLK edges following the instruction byte write the first RAM word. At this time, the internal address generator decrements and the next 32 rising edges of SCLK write the second RAM word. This cycle of decrementing the RAM address and writing 32-bit words continues until the last word is written. After the 64th word is written, the communication cycle is complete. To write to the RAM in LSB first format, complete the following steps: 1. 2. Set Bit 6 of Register 0x00 to 1. Apply an instruction byte of 0xEE followed by the data to be stored.
INPUT DATA RAM
The AD9785/AD9787/AD9788 feature on-chip RAM that can be used as an alternative input data source to the input data pins. The input data RAM is loaded through the SPI port. After the input data is stored in memory, the device can be configured to transmit the stored data instead of receiving data through the input data pins. This can be a useful test mode for factory or in-system testing. The RAM is 64 words long and 32 bits wide. The 16 MSBs drive the I datapath, and the 16 LSBs drive the Q datapath. The RAM configuration is shown in Figure 54.
All memory elements must be accessed to complete a communication cycle. Note that the RAM is not a dual-port memory element; therefore, if an I/O operation is begun while the RAM is being used to drive data into the signal processing path, the I/O operation has priority. To begin using the RAM as an internal data generator, set Register 0x1E (test register) to a value of 0x0C0. After these 24 bits are written, the DAC starts to output the waveform stored in memory.
I-SIDE 64 WORDS
RAM
Q-SIDE
0x1D
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16 BITS 32 BITS
16 BITS
Figure 54. Input Data RAM Configuration
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AD9785/AD9787/AD9788 DIGITAL DATAPATH
The AD9785/AD9787/AD9788 digital datapath consists of three 2x half-band interpolation filters, a quadrature modulator, and an inverse sinc filter. A 32-bit NCO provides the sine and cosine carrier signals required for the quadrature modulator.
10 0 -10 -20 ATTENUATION (dB) -30 -40 -50 -60 -70 -80 -90
07098-011 07098-012
INTERPOLATION FILTERS
The AD9785/AD9787/AD9788 contain three half-band filters that can be bypassed. This allows the device to operate with 2x, 4x, or 8x interpolation rates, or without interpolation. The interpolation filters have a linear phase response. The coefficients of the low-pass filters are given in Table 28, Table 29, and Table 30. Spectral plots for the filter responses are shown in Figure 55, Figure 56, and Figure 57. In 2x, 4x, or 8x interpolation mode, the usable bandwidth of the interpolation filter is 80% of the complex input data rate. The usable bandwidth has a pass-band ripple of less than 0.0005 dB and a stop-band attenuation of greater than 85 dB. The center frequency of the interpolation filter is set by the NCO frequency tuning word (Register 0x0A, Bits [31:0]), so baseband input signals are always centered in the interpolation filter pass band.
10 0 -10 -20
ATTENUATION (dB)
-100 -4
-3
-2
-1
0
1
2
3
4
fOUT (x Input Data Rate)
Figure 56. 4x Interpolation, Low-Pass Response to 4x Input Data Rate (Dotted Lines Indicate 1 dB Roll-Off)
10 0 -10 -20 ATTENUATION (dB) -30 -40 -50 -60 -70 -80 -90 -100 -4 -3 -2 -1 0 1 2 3 4
-30 -40 -50 -60 -70 -80 -90
07098-010
fOUT (x Input Data Rate)
Figure 57. 8x Interpolation, Low-Pass Response to 4x Input Data Rate (Dotted Lines Indicate 1 dB Roll-Off)
-100 -4
-3
-2
-1
0
1
2
3
4
fOUT (x Input Data Rate)
Figure 55. 2x Interpolation, Low-Pass Response to 4x Input Data Rate (Dotted Lines Indicate 1 dB Roll-Off)
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AD9785/AD9787/AD9788
Table 28. Half-Band Filter 1
Lower Coefficient H(1) H(2) H(3) H(4) H(5) H(6) H(7) H(8) H(9) H(10) H(11) H(12) H(13) H(14) H(15) H(16) H(17) H(18) H(19) H(20) H(21) H(22) H(23) H(24) H(25) H(26) H(27) H(28) Upper Coefficient H(55) H(54) H(53) H(52) H(51) H(50) H(49) H(48) H(47) H(46) H(45) H(44) H(43) H(42) H(41) H(40) H(39) H(38) H(37) H(36) H(35) H(34) H(33) H(32) H(31) H(30) H(29) Integer Value -4 0 +13 0 -34 0 +72 0 -138 0 +245 0 -408 0 +650 0 -1003 0 +1521 0 -2315 0 +3671 0 -6642 0 +20,755 +32,768
Table 29. Half-Band Filter 2
Lower Coefficient H(1) H(2) H(3) H(4) H(5) H(6) H(7) H(8) H(9) H(10) H(11) H(12) Upper Coefficient H(23) H(22) H(21) H(20) H(19) H(18) H(17) H(16) H(15) H(14) H(13) Integer Value -2 0 +17 0 -75 0 +238 0 -660 0 +2530 +4096
Table 30. Half-Band Filter 3
Lower Coefficient H(1) H(2) H(3) H(4) H(5) H(6) H(7) H(8) Upper Coefficient H(15) H(14) H(13) H(12) H(11) H(10) H(9) Integer Value -39 0 +273 0 -1102 0 +4964 +8192
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AD9785/AD9787/AD9788
QUADRATURE MODULATOR
The quadrature modulator is used to mix the carrier signal generated by the NCO with the upsampled I and Q data provided by the user at the 16-bit parallel input port of the device. Figure 58 shows a detailed block diagram of the quadrature modulator. The NCO provides a quadrature carrier signal with a frequency determined by the 32-bit frequency tuning word (FTW) set in Register 0x0A, Bits [31:0]. The NCO operates at the rate equal to the upsampled I data and Q data. The generated carrier signal is mixed via multipliers with the I data and Q data. The quadrature products are then summed. Note that the sine output of the NCO contains a mux that allows negating of the data. The mux is controlled with a spectral inversion bit that the user stores in an I/O register (Register 0x01, Bit 10). The default condition is to select negated sine data. results in an output signal that is offset by a constant angle relative to the nominal signal. This allows the user to phase align the NCO output with some external signal, if necessary. This can be especially useful when NCOs of multiple AD9785/ AD9787/AD9788 devices are programmed for synchronization. The phase offset allows for the adjustment of the output timing between the devices. The static phase adjustment is sourced from the NCO Phase Offset Word [15:0] value located in Register 0x0B. By default, when an SPI write is completed for the frequency tuning word, phase control, DAC gain scaling, or DAC offset registers (Register 0x0A through Register 0x0D), the operation of the AD9785/AD9787/AD9788 is immediately updated to reflect these changes. However, in many applications it may be more useful to update these registers without changing the device operation until all these functions can be updated at once. With the automatic I/O transfer enable bit set low in the COMM register (Register 0x00, Bit 1), the value of all these functions is stored in a buffer after the initial SPI write. To update all these functions simultaneously, Bit 2 of the COMM register should be set. This bit is self-resetting and thus does not require another reset in a later SPI write.
NUMERICALLY CONTROLLED OSCILLATOR
The NCO generates a complex carrier signal to translate the input signal to a new center frequency. A complex carrier signal is a pair of sinusoidal waveforms of the same frequency, offset 90 from each other. The frequency of the complex carrier signal is set via the Frequency Tuning Word [31:0] value in Register 0x0A. The frequency of the complex carrier signal is calculated as follows: If {0 FTW 231}, use fCENTER = (FTW) (fDACCLK)/232 If {231 < FTW < 232 - 1}, use fCENTER = fDACCLK x (1 - (FTW/232)) A 16-bit phase offset may be added to the output of the phase accumulator via the serial port. This static phase adjustment
INVERSE SINC FILTER
The inverse sinc filter is implemented as a nine-tap FIR filter. It is designed to provide greater than 0.05 dB pass-band ripple up to a frequency of 0.4 x fDACCLK. To provide the necessary peaking at the upper end of the pass band, the inverse sinc filter has an intrinsic insertion loss of 3.4 dB. The tap coefficients are given in Table 31.
I DATA
INTERPOLATION
COSINE FTW [31:0] NCO PHASE OFFSET WORD [15:0]
NCO
OUT_I SINE OUT_Q +
- -1 SPECTRAL INVERSION 0 1
Figure 58. Quadrature Modulator Block Diagram
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Q DATA
INTERPOLATION
AD9785/AD9787/AD9788
Table 31. Inverse Sinc Filter
Lower Coefficient H(1) H(2) H(3) H(4) H(5) Upper Coefficient H(9) H(8) H(7) H(6) - Integer Value +2 -4 +10 -35 +401
20 0
IOUTx_P (mA)
15
5
IOUTx_N (mA)
07098-108
10
10
The inverse sinc filter is disabled by default. It can be enabled by setting the inverse sinc enable bit (Bit 9) in Register 0x01.
5
15
DIGITAL AMPLITUDE AND OFFSET CONTROL
The gain of the I datapath and the Q datapath can be independently scaled by adjusting the I DAC Amplitude Scale Factor [8:0] or Q DAC Amplitude Scale Factor [8:0] value in Register 0x0C. These values control the input to a digital multiplier. The value of the scale factor ranges from 0 to 3.9921875 and can be calculated as follows:
0 0x0000 0x4000 0x8000 0xC000 20 0xFFFF DAC OFFSET VALUE
Figure 59. DAC Output Currents vs. DAC Offset Value
Scale Factor Value =
Scale Factor [8 : 0] 128
The offset currents generated by the DAC offset parameter increase from 0 mA to 10 mA as the offset is swept from 0 to 0x7FFF. The offset currents increase from -10 mA to 0 mA as the offset is swept from 0x8000 to 0xFFFF.
The digital scale factor can be used to compensate for the attenuation incurred by the digital modulator and the inverse sinc filter, as well as other factors. The dc value of the I datapath and the Q datapath can also be independently controlled. This is accomplished by adjusting the I DAC Offset [15:0] and Q DAC Offset [15:0] values in Register 0x0D. These values are added directly to the datapath values. Care should be taken not to overrange the transmitted values. Figure 59 shows how the DAC offset current varies as a function of the I DAC Offset [15:0] and Q DAC Offset [15:0] values. With the digital inputs fixed at midscale (0x0000, twos complement data format), the figure shows the nominal IOUTx_P and IOUTx_N currents as the DAC offset value is swept from 0 to 65535. Because IOUTx_P and IOUTx_N are complementary current outputs, the sum of IOUTx_P and IOUTx_N is always 20 mA.
DIGITAL PHASE CORRECTION
The purpose of the phase correction block is to enable compensation of the phase imbalance of the analog quadrature modulator following the DAC. If the quadrature modulator has a phase imbalance, the unwanted sideband appears with significant energy. Adjusting the phase correction word can optimize image rejection in single sideband radios. Ordinarily the I and Q channels have an angle of precisely 90 between them. The Phase Correction Word [9:0] (Register 0x0B) is used to change the angle between the I and Q channels. When the Phase Correction Word [9:0] is set to 1000000000b, the Q DAC output moves approximately 14 away from the I DAC output, creating an angle of 104 between the channels. When the Phase Correction Word [9:0] is set to 0111111111b, the Q DAC output moves approximately 14 towards the I DAC output, creating an angle of 76 between the channels. Based on these two endpoints, the resolution of the phase compensation register is approximately 28/1024 or 0.027 per code.
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AD9785/AD9787/AD9788 DEVICE SYNCHRONIZATION
System demands may impose two different requirements for synchronization. Some systems require multiple DACs to be synchronized to each other, for example, a system that supports transmit diversity or beamforming, where multiple antennas are used to transmit a correlated signal. In this case, the DAC outputs need to be phase aligned with each other, but there may not be a requirement for the DAC outputs to be aligned with a systemlevel reference clock. In systems with a time division multiplexing transmit chain, one or more DACs may be required to be synchronized with a system-level reference clock. Multiple devices are considered synchronized to each other when the state of the clock generation state machines is identical for all parts and the NCO phase accumulator is identical for all parts. Devices are considered synchronized to a system clock when there is a fixed and known relationship between the clock generation state machine and the NCO phase accumulator of the device to a particular clock edge of the system clock. The AD9785/AD9787/AD9788 support two modes of operation, pulse mode and PN code mode, for synchronizing devices under these two conditions. initialization pulse that sets the clock generation state machine logic to a known state. In pulse mode, this pulse is generated at every rising edge of the SYNC_I inputs. In PN code mode, the pulse is generated every time the correct code sequence is received on the SYNC_I inputs. This initialization pulse loads the clock generation state machine with the Clock State [3:0] value (Register 0x03, Bits [7:4]) as its next state. If the initialization pulse from the synchronization logic is generated properly, it is active for one DAC clock cycle, every 32 (or multiple of 32) DAC clock cycles. Because the clock generation state machine has 32 states operating at the DACCLK rate, every initialization pulse received after the first pulse loads the current state (the state to which the state machine is already set), maintaining the proper clock operation of the device. The Clock State [3:0] value is the state to which the clock generation state machine resets upon initialization. By varying this value, the timing of the internal clocks, with respect to the SYNC_I signal, can be adjusted. Every increment of the Clock State [3:0] value advances the internal clocks by one DACCLK period. The NCO phase accumulators can be initialized in pulse mode or PN code mode. In pulse mode, a simultaneous strobe signal must be sent to the TXENABLE pin of all devices that is synchronous to the DATACLK signal. This signal resets the phase accumulator of the NCOs across all devices, effectively synchronizing the NCOs. In PN code mode, the phase information of the master device is sent to the slave devices by the SYNC_I signal. The slave devices decode this phase information and automatically initialize their NCO phase accumulators to match the master device.
SYNCHRONIZATION LOGIC OVERVIEW
Figure 60 shows a block diagram of the on-chip synchronization receive logic. There are two different modes of operation for the multichip synchronization feature: pulse mode and pseudorandom noise code (PN code) modulation/demodulation mode. The basic function of these two modes is to initialize the internal clock generation state machine and the NCO phase accumulator upon the application of external signals to the device. The receive logic responsible for initializing the clock generation state machine generates a single DACCLK cycle-wide
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AD9785/AD9787/AD9788
DACCLK
NCO PHASE ACCUMULATOR RESET
CLOCK GENERATION STATE CLOCK STATE [3:0] LD-STATE
* * *
INTERNAL CLOCKS
NCO RESET GENERATOR PULSE MODE ENABLE
TXENABLE (PIN 39)
TRANSMIT PATH
0
1
SYNC MODE SELECT
EDGE DETECTOR
SYNC_I (PIN 13, PIN 14) SYNC_I DELAY [4:0]
t
CODE DEMODULATOR
PN CODE MODE ENABLE CORRELATE THRESHOLD [4:0]
07098-104
SYNC_I ENABLE
SYNC ERROR DETECTOR
SYNC TIMING ERROR IRQ
Figure 60. Synchronization Receive Circuitry Block Diagram
MATCHED LENGTH TRACES REFCLK TXENABLE SYNC_I SYSTEM CLOCK LOW SKEW CLOCK DRIVER REFCLK PULSE GENERATOR TXENABLE SYNC_I OUT OUT
LOW SKEW CLOCK DRIVER
MATCHED LENGTH TRACES
Figure 61. Multichip Synchronization in Pulse Mode
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SYNCHRONIZING DEVICES TO A SYSTEM CLOCK
The AD9785/AD9787/AD9788 offer a pulse mode synchronization scheme (see Figure 61) to align the DAC outputs of multiple devices within a system to the same DAC clock edge. The pulse mode synchronization scheme is a two-part operation. First, the internal clocks are synchronized by providing either a one-time pulse or periodic signal to the SYNC_I (SYNC_I+/SYNC_I-) inputs. The SYNC_I signal is sampled by the internal DACCLK sample rate clock. The SYNC_I input frequency has the following two constraints: high logic level pin, the strobe signal should be a low logic level pulse unless the TXENABLE invert bit is set in the SPI. For this synchronization scheme, all devices are slave devices, while the system clock generation/distribution chip serves as the master. The external LVDS signal should be connected to the SYNC_I inputs of all the slave devices following the constraints. The DAC clock inputs and the SYNC_I inputs must be matched in length across all devices. It is vital that the SYNC_I signal be distributed between the DACs with low skew. Likewise, the REFCLK signals must be distributed with low skew. Any skew on these signals between the DACs must be accounted for in the timing budget. The SYNC_I signal is sampled at the DACCLK rate, thus the data valid window of the SYNC_I pulse must be presented to all the DACs within the same DACCLK period. Figure 62 shows the timing of the SYNC_I input with respect to the REFCLK input. Note that although the timing is relative to the REFCLK signal, SYNC_I is sampled at the DACCLK rate. This means that the rising edge of the SYNC_I signal must occur after the hold time of the preceding DACCLK rising edge and not the preceding REFCLK rising edge. Figure 63 shows a timing diagram of the TXENABLE input.
f SYNC _ IN f DATACLK f SYNC _ IN = f DAC 16 x N
where N is an integer. When the internal clocks are synchronized, the data sampling clocks between all devices are phase aligned. The next step requires a simultaneous strobe signal to the TXENABLE pin of all devices that is synchronous to the DATACLK signal. This resets the phase accumulator of the NCOs across all devices, effectively synchronizing the NCOs. The strobe signal is sampled by fDATACLK and must meet the same setup and hold times as the input data. Because the TXENABLE pin is an active
SYNC_I
tH_SYNC
REFCLK
tS_SYNC
DACCLK
Figure 62. Timing Diagram of SYNC_I with Respect to REFCLK
REFCLK
DATACLK
tSREFCLK tSDATACLK
TXENABLE
tHREFCLK tHDATACLK
07098-105
Figure 63. Timing Diagram of TXENABLE vs. DATACLK and REFCLK
Rev. 0 | Page 44 of 64
07098-106
AD9785/AD9787/AD9788
Table 32 shows the register settings required to enable the pulse mode synchronization feature. Table 32. Register Settings for Enabling Pulse Sync Mode
Register 0x01 Bit [13] [12] [11] [26] [25] [10] Parameter PN code sync enable Sync mode select Pulse sync enable SYNC_I enable SYNC_O enable Set high Value 0 0 1 1 0 1
6.
7.
Read back sync timing error IRQ and sync timing error type (Register 0x09, Bit 4). If sync timing error IRQ is high, a sampling error has occurred, and sync timing error type indicates whether the sampling error is due to a setup time violation or a hold time violation. Adjust the SYNC_I Delay [4:0] value until the sync timing error IRQ is no longer present.
0x03
SYNCHRONIZING MULTIPLE DEVICES TO EACH OTHER
The AD9785/AD9787/AD9788 synchronization engine uses a PN code synchronization scheme to align multiple devices within a system to the same DAC clock edge. The PN code scheme synchronizes all the internal clocks, as well as the phase accumulator of the NCO for all devices. With this scheme, one device functions as the master, and the remainder of the devices are configured as slaves. The master device generates the PN encoded signal and drives the signal out on the SYNC_O (SYNC_O+/SYNC_O-) output pins. This signal is then sent to the SYNC_I (SYNC_I+/ SYNC_I-) inputs of all the slave devices and to itself. The slave devices receive the code from the master and demodulate the signal to produce a synchronization pulse every time a valid code is received. The encoded signal of every device must be sampled on the same DAC clock edge for the devices to be properly synchronized. Therefore, it is extremely important that the REFCLK signals arrive at all the devices with as little skew between them as possible. In addition, the SYNC_I signals must arrive at all the devices with as little skew as possible. At high DACCLK frequencies, this requires using low skew clock distribution devices to deliver the REFCLK and SYNC_I signals and paying careful attention to printed circuit board signal routing to equalize the trace lengths of these signals.
Synchronization Timing Error Detection
The synchronization logic has error detection circuitry similar to the input data timing. The Sync Timing Margin [3:0] variable (Register 0x03) determines the setup and hold margin that the synchronization interface needs for the SYNC timing error IRQ to remain inactive (show error-free operation). Thus, the SYNC timing error IRQ is set whenever the setup and hold margins drop below the Sync Timing Margin [3:0] value and does not necessarily indicate that the SYNC_I input was latched incorrectly. When a SYNC timing error IRQ is set, corrective action can restore the timing margin. The device can be configured for manual mode sync error monitoring and error correction. Follow these steps to monitor SYNC_I setup and hold timing margins in manual mode: 1. 2. 3. 4. 5. Set sync error check mode (Register 0x03, Bit 18) = 0 (manual check mode). Set Sync Timing Margin [3:0] (Register 0x03, Bits [3:0]) = 0000 (timing margin to minimum value). Set SYNC_I Delay [4:0] (Register 0x03, Bits [23:19]) = 00000 (SYNC_I delay line to minimum value). Set sync port IRQ enable (Register 0x09, Bit 0) = 1. Write 1 to sync timing error IRQ (Register 0x09, Bit 6) to clear.
MATCHED LENGTH TRACES REFCLK TXENABLE SYNC_I SYSTEM CLOCK LOW SKEW CLOCK DRIVER REFCLK TXENABLE SYNC_I SYNC_O OUT OUT
LOW SKEW CLOCK DRIVER
MATCHED LENGTH TRACES
07098-103
Figure 64. Multichip Synchronization in PN Code Mode
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AD9785/AD9787/AD9788
Table 33 lists the register settings required to enable the PN code mode synchronization feature. Table 33. Register Settings for Enabling PN Code Mode
Register 0x01 Bit [13] [12] [11] [31:27] [26] [25] [10] Parameter PN code sync enable Sync mode select Pulse sync enable Correlate Threshold [4:0] SYNC_I enable SYNC_O enable Set high Value 1 1 0 10000 1 0 (slave devices) 1 (master device) 1
The Correlate Threshold [4:0] value (Register 0x03, Bits [31:27]) indicates how closely the code of the received SYNC_I signal is to the expected code. A high threshold requires a closer match of the encoded signal to set the sync lock status bit; a lower value reduces the matching requirements to set the sync lock status bit. Increasing the Correlate Threshold [4:0] value makes the part more resistant to false synchronization locks but requires a lower bit error rate on the SYNC_I input to maintain locked status. Decreasing the Correlate Threshold [4:0] value makes the part more susceptible to false synchronization locks, but maintains a locked status in the face of a higher bit error rate on the SYNC_I input (that is, it is more noise resistant). The recommended value for Correlate Threshold [4:0] is the default value of 16.
0x03
To verify that the devices have successfully synchronized, read back the sync lock status bit on all devices (Register 0x09, Bit 10). The sync lock status bit should read back as 1 on all devices. Next, read back the sync lock lost status bit on all devices (Register 0x09, Bit 11). The sync lock lost status bit should read back as 0 on all devices. To clear the sync lock lost status bit, set the clear lock indicator bit to 1, followed by a 0 (Register 0x09, Bit 12). Because the SYNC_O signal generated by the master is spread over many bits, this method of synchronization is very robust. Any individual bits that may become corrupted or somehow misread by the slave device usually have no effect on the synchronization of the device. If the devices do not reliably synchronize, there are several options for correcting the situation. The SYNC_O Delay [4:0] value (Register 0x03, Bits [15:11]) on the master device can be used to adjust the timing in 80 ps steps effective across all devices. In addition, the SYNC_O polarity bit (Register 0x03, Bit 9) on the master device can be set to provide a delay of one half the DACCLK period. The SYNC_I Delay [4:0] bits (Register 0x03, Bits [23:19]) can be used to adjust the timing on a single slave device in 80 ps steps.
INTERRUPT REQUEST OPERATION
The IRQ pin (Pin 71) acts as an alert that the device has experienced a timing error and that it should be queried (by reading Register 0x09) to determine the exact fault condition. The IRQ pin is an open-drain, active low output. The IRQ pin should be pulled high external to the device. This pin may be tied to the IRQ pins of other devices with open-drain outputs to wire-OR these pins together. There are two different error flags that can trigger an interrupt request: a data timing error or a sync timing error. By default, when either or both of these error flags are set, the IRQ pin is active low. Either or both of these error flags can be masked to prevent them from activating an interrupt on the IRQ pin. The error flags are latched and remain active until the flag bits are overwritten.
Rev. 0 | Page 46 of 64
AD9785/AD9787/AD9788 DRIVING THE REFCLK INPUT
The REFCLK input requires a low jitter differential drive signal. REFCLK is a PMOS input differential pair powered from the 1.8 V supply; therefore, it is important to maintain the specified 400 mV input common-mode voltage. Each input pin can safely swing from 200 mV p-p to 1 V p-p about the 400 mV common-mode voltage. Although these input levels are not directly LVDScompatible, REFCLK can be driven by an offset ac-coupled LVDS signal, as shown in Figure 65.
0.1F LVDS_P_IN 50 VCM = 400mV 50 LVDS_N_IN 0.1F REFCLK-
07098-024
on-chip clock multiplier removes the burden of generating and distributing the high speed DACCLK. The second mode bypasses the clock multiplier circuitry and allows DACCLK to be directly sourced through the REFCLK pins. This mode enables the user to source a very high quality clock directly to the DAC core. Sourcing the DACCLK directly through the REFCLK pins may be necessary in demanding applications that require the lowest possible DAC output noise at higher output frequencies. In either case, using the on-chip clock multiplier or sourcing the DACCLK directly through the REFCLK pins, it is necessary that the REFCLK signal have low jitter to maximize the DAC noise performance.
REFCLK+
Direct Clocking
When the PLL is disabled (Register 0x04, Bit 15 = 0), the REFCLK input is used directly as the DAC sample clock (DACCLK). The output frequency of the DATACLK output pin is fDATACLK = fDACCLK / IF where IF is the interpolation factor, set in Register 0x01, Bits [7:6].
Figure 65. LVDS REFCLK Drive Circuit
If a clean sine clock is available, it can be transformer-coupled to REFCLK, as shown in Figure 66. Use of a CMOS or TTL clock is also acceptable for lower sample rates. It can be routed through a CMOS-to-LVDS translator, then ac-coupled.
TTL OR CMOS CLK INPUT 0.1F 50 REFCLK+
Clock Multiplication
07098-025
REFCLK- 50 BAV99ZXCT HIGH SPEED DUAL DIODE VCM = 400mV
When the PLL is enabled (Register 0x04, Bit 15 = 1), the clock multiplication circuit generates the DAC sample clock from the lower rate REFCLK input. The functional diagram of the clock multiplier is shown in Figure 68. The clock multiplication circuit operates such that the VCO outputs a frequency, fVCO, equal to the REFCLK input signal frequency multiplied by N1 x N2. fVCO = fREFCLK x (N1 x N2) The DAC sample clock frequency, fDACCLK, is equal to fDACCLK = fREFCLK x N2 The values of N1 and N2 must be chosen to keep fVCO in the optimal operating range of 1.0 GHz to 2.0 GHz. When the VCO output frequency is known, the correct PLL band select value (Register 0x04, Bits [7:2]) can be chosen.
Figure 66. TTL or CMOS REFCLK Drive Circuit
A simple bias network for generating VCM is shown in Figure 67. It is important to use CVDD18 and CGND for the clock bias circuit. Any noise or other signal that is coupled onto the clock is multiplied by the DAC digital input signal and can degrade DAC performance.
VCM = 400mV CVDD18 1k 287 0.1F 1nF CGND
07098-026
1nF
Figure 67. REFCLK VCM Generator Circuit
PLL Bias Settings
There are three bias settings for the PLL circuitry that should be programmed to their nominal values. The PLL values shown in Table 34 are the recommended settings for these parameters. Table 34. PLL Settings
PLL SPI Control PLL Loop Bandwidth PLL VCO Drive PLL Bias Address Register Bit 0x04 [20:16] 0x04 [1:0] 0x04 [10:8] Optimal Setting 01111 11 011
DAC REFCLK CONFIGURATION
The AD9785/AD9787/AD9788 offer two modes of sourcing the DAC sample clock (DACCLK). The first mode employs an on-chip clock multiplier that accepts a reference clock operating at the lower input frequency, most commonly the data input frequency. The on-chip phase-locked loop (PLL) then multiplies the reference clock up to a higher frequency, which can then be used to generate all the internal clocks required by the DAC. The clock multiplier provides a high quality clock that meets the performance requirements of most applications. Using the
Rev. 0 | Page 47 of 64
AD9785/AD9787/AD9788
PLL_LOCK (PIN 65) 0x09 [3] ADC 0x04 [23:21] VCO CONTROL VOLTAGE
REFCLK (PIN 5 AND PIN 6)
PHASE DETECTION
LOOP FILTER
VCO
/N2 0x04 [12:11] PLL LOOP DIVISOR
/N1 0x04 [14:13] PLL VCO DIVISOR /IF 0x01 [7:6]
07098-027
DAC INTERPOLATION RATE DATACLK (PIN 37)
0x04 [15] PLL ENABLE DAC CLOCK
Figure 68. Clock Multiplication Circuit
Table 35. Typical VCO Freq Range vs. PLL Band Select Value
PLL Lock Ranges over Temperature, -40C to +85C VCO Frequency Range in MHz 1 PLL Band Select fLOW fHIGH 111111 (63) Auto mode Auto mode 111110 (62) 1975 2026 111101 (61) 1956 2008 111100 (60) 1938 1992 111011 (59) 1923 1977 111010 (58) 1902 1961 111001 (57) 1883 1942 111000 (56) 1870 1931 110111 (55) 1848 1915 110110 (54) 1830 1897 110101 (53) 1822 1885 110100 (52) 1794 1869 110011 (51) 1779 1853 110010 (50) 1774 1840 110001 (49) 1748 1825 110000 (48) 1729 1810 101111 (47) 1730 1794 101110 (46) 1699 1780 101101 (45) 1685 1766 101100 (44) 1684 1748 101011 (43) 1651 1729 101010 (42) 1640 1702 101001 (41) 1604 1681 101000 (40) 1596 1658 100111 (39) 1564 1639 100110 (38) 1555 1606 100101 (37) 1521 1600 100100 (36) 1514 1575 100011 (35) 1480 1553 100010 (34) 1475 1529 100001 (33) 1439 1505 100000 (32) 1435 1489 PLL Lock Ranges over Temperature, -40C to +85C VCO Frequency Range in MHz 1 PLL Band Select fLOW fHIGH 011111 (31) 1402 1468 011110 (30) 1397 1451 011101 (29) 1361 1427 011100 (28) 1356 1412 011011 (27) 1324 1389 011010 (26) 1317 1375 011001 (25) 1287 1352 011000 (24) 1282 1336 010111 (23) 1250 1313 010110 (22) 1245 1299 010101 (21) 1215 1277 010100 (20) 1210 1264 010011 (19) 1182 1242 010010 (18) 1174 1231 010001 (17) 1149 1210 010000 (16) 1141 1198 001111 (15) 1115 1178 001110 (14) 1109 1166 001101 (13) 1086 1145 001100 (12) 1078 1135 001011 (11) 1055 1106 001010 (10) 1047 1103 001001 (9) 1026 1067 001000 (8) 1019 1072 000111 (7) 998 1049 000110 (6) 991 1041 000101 (5) 976 1026 000100 (4) 963 1011 000011 (3) 950 996 000010 (2) 935 981 000001 (1) 922 966 000000 (0) 911 951
1
The lock ranges in this table are typical values. Actual lock ranges will vary from device to device.
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AD9785/AD9787/AD9788
Configuring the PLL Band Select Value
The PLL VCO has a valid operating range from approximately 1.0 GHz to 2.0 GHz covered in 63 overlapping frequency bands as shown in Table 35. For any desired VCO output frequency, there are multiple valid PLL band select values. Note that the data shown in Table 35 is for a typical device. Device-to-device variations can shift the actual VCO output frequency range by 30 MHz to 40 MHz. Also, the VCO output frequency varies as a function of temperature. Therefore, it is required that the optimal PLL band select value be determined for each individual device at the particular operating temperature. The device has an automatic PLL band select feature on chip. When enabled, the device determines the optimal PLL band setting for the device at the given temperature. This setting holds for a 60C temperature swing in ambient temperature. If the device operates in an environment that experiences a larger temperature swing, an offset should be applied to the automatically selected PLL band. The following procedure outlines a method for setting the PLL band select value for a device operating at a particular temperature that holds for a change in ambient temperature over the total -40C to +85C operating range of the device without further user intervention. (Note that REFCLK must be applied to the device during this procedure.) 4. Based on the temperature when the PLL auto mode is enabled, set the PLL band indicated in Table 36 or Table 37 by rewriting the readback values into the PLL Band Select [5:0] parameter (Register 0x04, Bits [7:2]).
Table 36. Setting Optimal PLL Band for Lower Range (0 to 31) Bands
System Start-Up Temperature -40C to -10C -10C to +15C 15C to 55C 55C to 85C Set PLL Band to Readback Band + 2 Readback Band + 1 Readback Band Readback Band - 1
Table 37. Setting Optimal PLL Band for Higher Range (32 to 62) Bands
System Start-Up Temperature -40C to -30C -30C to -10C -10C to +15C 15C to 55C 55C to 85C Set PLL Band to Readback Band + 3 Readback Band + 2 Readback Band + 1 Readback Band Readback Band - 1
Known Temperature Calibration with Memory
The procedure in the Configuring PLL Band Select with Temperature Sensing section requires temperature sensing upon start-up or reset of the device to choose the optimal PLL band select value to hold over the entire operating temperature range. If temperature sensing is not available in the system, another option is to use the automatic PLL band select to determine the optimal setting for the device when the device is in a factory environment where the temperature is known. The optimal band can then be stored in nonvolatile memory. Whenever the system is powered up or restarted, the optimal value can be loaded back into the device.
Configuring PLL Band Select with Temperature Sensing
The values of N1 (Register 0x04, Bits [14:13]) and N2 (Register 0x04, Bits [12:11]) should be programmed along with the PLL settings shown in Table 34. 1. 2. Set the PLL Band Select [5:0] value (Register 0x04, Bits [7:2]) to 63 to enable PLL auto mode. Wait for the PLL_LOCK pin or the PLL lock indicator (Register 0x09, Bit 3) to go high. This should occur within 5 ms. Read back the 6-bit PLL band select value (Register 0x04, Bits [7:2]).
3.
Rev. 0 | Page 49 of 64
AD9785/AD9787/AD9788 ANALOG OUTPUTS
Full-scale current on the I DAC and Q DAC can be set from 8.66 mA to 31.66 mA. Initially, the 1.2 V band gap reference is used to set up a current in an external resistor connected to I120 (Pin 75). A simplified block diagram of the reference circuitry is shown in Figure 69.
AD9788
1.2V BAND GAP REFERENCE 5k CURRENT SCALING I DAC GAIN I DAC DAC FULL-SCALE REFERENCE CURRENT
07098-030
DIGITAL AMPLITUDE SCALING
Gain scaling of the analog DAC output can be achieved by changing the values in Register 0x05 and Register 0x07. However, if this is done, the output common-mode voltage at the analog output also decreases proportionally. This poses a problem when the AD9785/AD9787/AD9788 are dc-coupled to a quadrature modulator. Typical quadrature modulators have tight restrictions on input common-mode variation. The AD9785/AD9787/AD9788 use a digital gain scaling block to get around this problem. Because the gain scaling is done in the digital processing of the AD9785/AD9787/AD9788, there is no effect on the output full-scale current. This digital gain scaling is done in such a way that the midscale value of the signal is unaffected; the swing of the signal around midscale is the value that is adjusted with the register settings. Digital gain scaling is done using the amplitude scale factor (ASF) register (Register 0x0C).
VREF 0.1F I120 10k
Q DAC Q DAC GAIN
Figure 69. Full-Scale Current Generation Circuitry
The recommended value for the external resistor is 10 k, which sets up an IREFERENCE in the resistor of 120 A, which in turn provides a DAC output full-scale current of 20 mA. Because the gain error is a linear function of this resistor, a high precision resistor improves gain matching to the internal matching specification of the devices. Internal current mirrors provide a current-gain scaling, where DAC gain is a 10-bit word in the SPI port register (Register 0x05 and Register 0x07). The default value for the DAC gain registers gives an IFS of approximately 20 mA, where IFS for either I DAC or Q DAC is equal to
Auxiliary DAC Operation
Two auxiliary DACs are provided on the AD9785/AD9787/ AD9788. The full-scale output current on these DACs is derived from the 1.2 V band gap reference and external resistor. The gain scale from the reference amplifier current, IREFERENCE, to the auxiliary DAC reference current is 16.67 with the auxiliary DAC gain set to full scale (10-bit values, Register 0x06, Bits [9:0] and Register 0x08, Bits [9:0]). This gives a full-scale current of approximately 2 mA for Auxiliary DAC 1 and Auxiliary DAC 2. The auxiliary DAC outputs are not differential. Only one side of the auxiliary DAC (P or N) is active at one time. The inactive side goes into a high impedance state (100 k). In addition, the P or N output can act as a current source or a current sink. Control of the P and N sides for both auxiliary DACs is via Register 0x06 and Register 0x08, Bits [15:14]. When sourcing current, the output compliance voltage is 0 V to 1.6 V. When sinking current, the output compliance voltage is 0.8 V to 1.6 V.
1.2 V 27 6 x + x DAC gain x 32 R 12 1024
35 30 25 20 15 10 5 0
IFS (mA)
0
200
400
600
800
1000
DAC GAIN CODE
Figure 70. DAC Full-Scale Current vs. DAC Gain Code
07098-031
Rev. 0 | Page 50 of 64
AD9785/AD9787/AD9788
There are two output signals on each auxiliary DAC. One signal is designated P, the other N. The sign bit in each auxiliary DAC control register (Bit 15) controls whether the P side or the N side of the auxiliary DAC is turned on. Only one side of the auxiliary DAC is active at a time. The auxiliary DAC structure is shown in Figure 71.
0 TO 2mA (SOURCE) VBIAS AUX_P
The choice of sinking or sourcing should be made at circuit design time. There is no advantage to switching between sourcing and sinking current after the circuit is in place. The auxiliary DACs can be used for local oscillator (LO) cancellation when the DAC output is followed by a quadrature modulator. This LO feedthrough is caused by the input referred dc offset voltage of the quadrature modulator (and the DAC output offset voltage mismatch) and can degrade system performance. Typical DAC-to-quadrature modulator interfaces are shown in Figure 72 and Figure 73. Often, the input common-mode voltage for the modulator is much higher than the output compliance range of the DAC, so that ac coupling or a dc level shift is necessary. If the required common-mode input voltage on the quadrature modulator matches that of the DAC, then the dc blocking capacitors in Figure 72 can be removed. A low-pass or band-pass passive filter is recommended when spurious signals from the DAC (distortion and DAC images) at the quadrature modulator inputs can affect system performance. Placing the filter at the location shown in Figure 72 and Figure 73 allows easy design of the filter, as the source and load impedances can easily be designed close to 50 .
0 TO 2mA (SINK) P/N SOURCE/ SINK
AUX_N
07098-032
Figure 71. Auxiliary DAC Structure
The magnitude of the auxiliary DAC 1 current is controlled by the auxiliary DAC 1 control register (Register 0x06), and the magnitude of the auxiliary DAC 2 current is controlled by the auxiliary DAC 2 control register (Register 0x08). These auxiliary DACs have the ability to source or sink current. This selection is programmable via Bit 14 in either auxiliary DAC control register.
QUADRATURE MODULATOR V+ AUX DAC1 QUADRATURE MODULATOR V+ 0.1F I DAC 0.1F 25 TO 50 0.1F Q DAC 0.1F 25 TO 50
07098-033
OPTIONAL PASSIVE FILTERING
QUAD MOD I INPUTS
AUX DAC2
OPTIONAL PASSIVE FILTERING
QUAD MOD Q INPUTS
Figure 72. Typical Use of Auxiliary DACs AC Coupling to Quadrature Modulator
AUX DAC1 OR DAC2
I OR Q DAC
OPTIONAL PASSIVE FILTERING
QUAD MOD I AND Q INPUTS
07098-115
25 TO 50
25 TO 50
Figure 73. Typical Use of Auxiliary DACs DC Coupling to Quadrature Modulator with DC Shift
Rev. 0 | Page 51 of 64
AD9785/AD9787/AD9788 POWER DISSIPATION
Figure 74 through Figure 78 detail the power dissipation of the AD9785/AD9787/AD9788 under a variety of operating conditions. All of the graphs are taken with data being supplied to both the I and Q channels. The power consumption of the device does not vary significantly with changes in the modulation mode or analog output frequency. Graphs of the total power dissipation are shown along with the power dissipation of the DVDD18, DVDD33, and CVDD18 supplies. The power dissipation of the AVDD33 supply rail is independent of the digital operating mode and sample rate. The current drawn from the AVDD33 supply rail is typically 51 mA (182 mW) when the full-scale current of the I and Q DACs is set to the nominal value of 20 mA. Changing the full-scale current directly impacts the supply current drawn from the AVDD33 rail. For example, if the full-scale current of the I DAC and the Q DAC is changed to 10 mA each, the AVDD33 supply current drops to 31 mA.
70 60 8x NCO 1200 POWER (mW) 1000 800 600 400 200 0 1x NCO 1x 2x 4x NCO 8x POWER (mW) 4x 2x NCO 50 40 30 20 10 0
07098-035
1800 1600 1400
8x NCO 8x 4x NCO 4x 2x NCO 2x 1x NCO 1x
07098-037 07098-038
0
50
100
150
200
250
300
0
50
100
150
200
250
300
fDATA (MSPS)
fDATA (MSPS)
Figure 74. Power Dissipation, I and Q Data, Dual DAC Mode
1400 1200 1000 POWER (mW) 800 600 2x 400 200 0 1x NCO 1x 8x 2x NCO 4x NCO 8x NCO 4x POWER (mW)
Figure 76. Power Dissipation, Digital 3.3 V Supply, I and Q Data, Dual DAC Mode
120
100
80
60
40
20
0
07098-036
2x NCO 2x 1x NCO 1x 0 50 100 150 200 250
8x NCO 8x 4x NCO 4x 300
0
50
100
150
200
250
300
fDATA (MSPS)
fDATA (MSPS)
Figure 75. Power Dissipation, Digital 1.8 V Supply, I and Q Data, Dual DAC Mode
Figure 77. Power Dissipation, Clock 1.8 V Supply, I and Q Data, Dual DAC Mode
Rev. 0 | Page 52 of 64
AD9785/AD9787/AD9788
140 120 100 POWER (mW) 80 60 40 20 0
fDAC (MSPS)
Figure 78. Digital 1.8 V Supply, Power Dissipation of Inverse Sinc Filter
07098-039
0
200
400
600
800
1000
Rev. 0 | Page 53 of 64
AD9785/AD9787/AD9788 AD9785/AD9787/AD9788 EVALUATION BOARDS
The remainder of this data sheet describes the evaluation boards for testing the AD9785, AD9787, and AD9788 devices. The factory default jumper configuration is as follows: * * Jumpers JP2, JP3, JP4, and JP8 are unsoldered. Jumpers JP14, JP15, JP16, and JP17 are soldered.
OUTPUT CONFIGURATION
Each evaluation board contains an Analog Devices ADL5372 quadrature modulator. The AD9785/AD9787/AD9788 devices and the ADL5372 provide an easy-to-interface DAC/modulator combination that can be easily characterized on the evaluation board. Solderable jumpers can be configured to evaluate the singleended or differential outputs of the AD9785/AD9787/AD9788.
To evaluate the ADL5372 on the evaluation board, reverse the jumper positions as follows: * * Jumpers JP2, JP3, JP4, and JP8 are soldered. Jumpers JP14, JP15, JP16, and JP17 are unsoldered.
Note that the ADL5372 also requires its own separate 5 V and GND connection on the evaluation board.
DIGITAL PICTURE OF EVALUATION BOARD
5V POWER
SYNC INPUTS REFCLK INPUT JP4 JP15 DIGITAL DATA INPUTS
AD9788
S5 +5V
GND
JP8 JP14 S8 S9 JP3 JP16 ADL5372
ADL5372 OUTPUT ADL5372 LO INPUT
DATACLK OUTPUT
JP2 JP17 S6
RESET SYNC OUTPUTS SPI PORT
Figure 79. Evaluation Board
Rev. 0 | Page 54 of 64
07098-058
AD9785/AD9787/AD9788
EVALUATION BOARD SOFTWARE
A GUI .exe file for Microsoft(R) Windows(R) is included on the CD that ships with the evaluation board. This file allows the user to easily program all the functions on the AD9785/AD9787/AD9788.
INTERPOLATION AND FILTER MODE SETTINGS
Figure 80 shows this user interface. The most important features for configuring the AD9785/AD9787/AD9788 are called out in the figure.
I/Q CHANNEL GAIN MATCHING
DIGITAL GAIN SCALING
I/Q OFFSET CONTROL
I/Q PHASE COMPENSATION
NCO FREQUENCY AND PHASE OFFSET
Figure 80. AD9788 User Interface
Rev. 0 | Page 55 of 64
07098-059
I/Q FULL SCALE OUTPUT CURRENT CONTROL
TP1 RED TP14 EXC-CL4532U1 RED
LC1812 VDDM_IN
EXC-CL4532U1 L12 VDDM RED C66
CC0402
TP13
L1
LC1812
CVDD18_IN C46
ACASE CC0402
CVDD18 .1UF
CC0603 GND
C67 .1UF U6 3
GND
C77
CC0603
.1UF TP15 .1UF BLACK TP2 BLK C68 C69 22UF 16V
ACASE
22UF
RED TP17
SO14
4 74AC14 U6 11
SO14
AD9785/AD9787/AD9788
16V
10 74AC14 U6 9
SO14
EVALUATION BOARD SCHEMATICS
TP3 EXC-CL4532U1 L2
LC1812
8 74AC14
RED DVDD18 .1UF
CC0603
DVDD18_IN .1UF
CC0603
U6 5
SO14
6 74AC14
C76 C71 TP4 BLK C70
22UF
ACASE
RED TP18
16V
TP5 RED EXC-CL4532U1 L3
LC1812
RC080 5
16V TP9 BLK
RC080 5
07098-044
Figure 81. Evaluation Board, Power Supply and Decoupling
AVDD33 .1UF U5 2
SO14 CC0603
Rev. 0 | Page 56 of 64
.1UF
CC0603
AVDD33_IN
C20 1 C28 TP8 BLK 4 74AC14 U5 EXC-CL4532U1 L4
LC1812
U5 12 74AC14 U5
SO14
R51 13
9K
RC0805
ACASE
RED TP19 C26 74AC14 U5
SO14
22UF 16V 3
R53 10 74AC14 U5 R54
SO14
9K 11
RC0805
P1 9K 1
TP6 RED
SPI_CSB SCLK
DVDD33 .1UF
CC0603
6 74AC14
SO14
5
8 74AC14
SO14
9
RC0805
2 3 4 U6 U6 1
SO14
DVDD33_IN .1UF
CC0603
SPI_SDIO SPI_SDO
2 74AC14 13
SO14
5 12 74AC14
TJAK06RAP CLASS=IO
C21 C45 C42
RED
6
ACASE
22UF
TP20
R55 10K
R52 10K RED TP16
FCI-68898
AD9785/AD9787/AD9788
IOUT-IOUT_P IOUT_N
AUX2_N R 15
RC 060 3 RC 060 3
AUX2_P
AUX1_N
AUX1_P
S8
2
R 17
R 12
RC 060 3
R3
RC 060 3
1
50 0
50 0
50 0
50 0
RC0603
RC0603
RC0603
RC0603
S5
R14
R16 QN
250
250
250 JP11
250
R2
2
R4
R 20
RC 060 3
1
R 19 0
RC 060 3
DNP JP5 JP1 JP6 QP IN
4 TC1-1T
6 3 P T2B ADTL1-12 1
IP
T2A 3 2 1
S 4 6
S12
S15
3
1
4
6
TC1-1T
P
2 1
ADTL1-12
2 1
.1UF
.1UF
1NF
1NF
C60
C61
C59
C62
T1B
T1A
CVDD18
C6
ACA S E
V O LT IP .1UF .1UF
.1UF
.1UF
.1UF
1NF
1NF
C31
1NF
CC 040 2
C14
C55
C57
C56
C58 3 2 1
CC 040 2 CC 040 2 CC 040 2 CC 040 2
S 4 6
AVDD33
CC 040 2
CC 040 2
CC 040 2
CC 040 2
CC 040 2
JP14 IN
C33
C37
C24
JP15
1NF
1NF
C9
C1
4 .7U F
4.7UF
4.7UF
CLK_N
CLK_P
C15
1 2 3 4 5 6 7 8
VDDC 18 _ 1 VDDC 18 _ 2 V SS C _ 3 V SS C _ 4 CLK_P CLK_N V SS C _ 7 V SS C _ 8 VDDC 18 _ 9 VDDC 18 _ 1 0 V SS C _ 1 1 V SS_ 1 2 S Y N C _1P S Y N C _1N V SS D _ 1 5 VDDD 33 _ 1 6 P1D15 P1D14 P1D13 P1D12 P1D11 V SS D _ 2 2 VDDD 18 _ 2 3 P1D10 P 1 D9 P 1 D8 P 1 D7 P 1 D6 P 1 D5 P 1 D4 P 1 D3 V SS D _ 3 2 VDDD 18 _ 3 3 P 1 D2 P 1 D1 P 1 D0 DC L K VDDD 33 _ 3 8 TX P2D15 P2D14 P2D13 VDD 18 _ 4 3 V SS D _ 4 4 P2D12 P2D11 P2D10 P 2 D9 P 2 D8 P 2 D7
VDDA 33 _ 10 0 V SS A _ 9 9 VDDA 33 _ 9 8 V SS A _ 9 7 VDDA 33 _ 9 6 V SS A _ 9 5 V SS A _ 9 4 IOU T 1 _ P IOU T 1 _ N V SS A _ 9 1 A U X 1_ P A U X 1_ N V SS A _ 8 8 A U X 2_ N A U X 2_ P V SS A _ 8 5 IOU T 2 _ N IOU T 2 _ P V SS A _ 8 2 V SS A _ 8 1 VDDA 33 _ 8 0 V SS A _ 7 9 VDDA 33 _ 7 8 V SS A _ 7 7 VDDA 33 _ 7 6 I12 0 VR E F _ 7 4 IPT AT V SS_ 7 2 IRQ R ESE T SP I_ C S B SP I_ C L K SP I_S DI SP I_ S DO P LL _ LO CK V SS D _ 6 4 S YN C _O P S YN C _O N VDDD 33 _ 6 1 VDDD 18 _ 6 0 P 2 D0 P 2 D1 P 2 D2 P 2 D3 P 2 D4 V SS D _ 5 4 VDDD 18 _ 5 3 P 2 D5 P 2 D6 P AD
10 0 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83
ACA S E
CC 040 2
CC 040 2
CC 040 2
CC 040 2
CC 040 2
CC 040 2
10 11 12 13 14 15 16 P1D15 P1D14 P1D13 P1D12 P1D11 U11 GND 17 18 19 20 21 22 23 P1D10 P1D9 24 25 26 27 28 29 30 31 32 33
CC 060 3 RC0603
IOUT1_N
R9 50 AUX1_P AUX1_N JP8 D2N
AUX2_N AUX2_P JP3 D1N
IOUT2_N
82 81
IOUT2_P
JP2
RC 060 3
80 79 78
RC 080 5
77 10K R56 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 1 60 59 58 57 56 55 54 53 52 51 P AD P2D5 P2D6 P2D0 P2D1 1K R 64
RC 120 6
CC 060 3
P1D8 P1D7 P1D6 P1D5
RC 060 3
RED TP 1 1 TP 1 2 CR 1 RED VAL 1K SPI_CSB SPI_CLK SPI_SDI VAL SPI_SDO
RC 120 6
RC 060 3
P1D4 P1D3
P1D2 P1D1 P1D0
34 35 36 37 38 39
SW1
4 3 2 1
R 65
GN D ;5
R 63 10 K
P2D15 P2D14 P2D13 JP18
40 41 42 43 44
P2D2 2 P2D3 P2D4
P2D12 74LCX112 P2D11 P2D10 P2D9 P2D8 P2D7 3 2 1
45 46 47 48 49 50
U1
9779 T QF P R 21
RC 060 3
DNP
2
1
ACA S E
V O LT
CC 040 2 ACA S E
CC 040 2
CC 040 2
CC 040 2
CC 040 2 ACA S E
CC 040 2
CC 040 2
CC 040 2
VOLT 1NF
V O LT 4 .7U F
CC 040 2 ACA S E
CC 040 2
CC 040 2
CC 040 2
CC 040 2
CC 040 2
VOLT
4 .7U F
Figure 82. Evaluation Board, Analog and Digital Interfaces to TxDAC
Rev. 0 | Page 57 of 64
07098-045
RC 060 3
9
RC 060 3
ACA SE
CR 2
ACA S E
V O LT
ACA S E
V O LT
1NF
VOLT
C78
C7
R5
0
0 R6
S7
4 .7U F D1P
2 1
RC0603
RC0603
R1
50
JP4
C32 SN74LVC1G34 100 R26 C84 U10 15 74LCX112 GND
IOUT1_P
.1UF
DVDD33
5 VCC NC 1 .1UF K CLR Q_ 6 12 U10 14 CLR Q_ 7 K CLK Q 2 A 2 CLK 1 3 3 J PRE 5 13 4 Y
R3 2 25
R10
RC 060 3
50
RC0603
RC0603
R11
50
1NF
R7
R8
C8 C18 6.3V
D2P
QP 0 0
QN
10UF
DVDD33
JP17
JP16
100
R18
6 S T3B P
4 ADTL1-12
1
2
3 T3A TC1-1T
RC1206
4
1
3
6
S14
2
DVDD33
1
1
2
3
S11
6 S T4B
4 ADTL1-12 T4A TC1-1T
6PINCONN
P 1 3 4 6
4 4 5 6 22
JP7
DVDD33
11 J 10 PRE Q 9
DVDD18
P2D15
R 22
RC 060 3
R58
S6
4.7UF
22
RC0805
R59
C4
QOUT-QOUT_P
RC0805
0 1 2
DVDD33
S9
DVDD33
1
S16
2
QOUT_N
C10
C25
C38
.1UF
.1UF
1NF
C12
C29
.1UF
1NF
C2
DVDD18
C34
C5 C30 C13 .1UF 1NF 4.7UF C35 C27 C3 6 C4 0 C3 1NF 1NF 1NF C39 C11 .1UF .1UF .1UF
MOD_IP
VAL
CC0603 RC0603
VAL L10 C82
CC0603
C81
D1N
LC0805
VAL L11
CC0603
VAL VAL
MOD_IN
CC0603
AD9785/AD9787/AD9788
C80
C79
VAL
CC0603 RC0603 CC0603
VAL
MOD_QN
C7 4 L8
LC0805
C7 5
D2N
R23
D2P
LC0805
DNP
VAL
DNP
VAL
R24
D1P
LC0805
.1UF C52 C51
100PF
VAL L9
CC0603
VAL
MOD_QP
CC0603
VAL C64
VDDM C44
CC0402 CC0402 ACASE
C65
10UF 10V
MOD_QN MOD_QP MOD_IN MOD_IP GND
VDDM
RC0603
PAD
24
23
22
21
JP12 10K
GND
R25
1 2 3 18 17
20
19
U9
CC0402
100PF C83 .1UF L17
LC0805
C90 VDDM
16 4 5 15
LC0805 CC0402
10
GND
100PF VDDM C41
CC0402 CC0402 CC0402 ACASE
C53
C54
100PF
100PF
100PF
C73
07098-046
2
GND
Figure 83. Evaluation Board, ADL5372 (FMOD2) Quadrature Modulator
11
12
Rev. 0 | Page 58 of 64
VDDM C43
CC0402 ACASE CC0402
VAL
14 6 13
CC0402
VAL L18 C87
7 8 9
10UF 10V C47 .1UF
C50
FMOD
100PF
C72
CC0402 CC0402
C63 .1UF
GND
10UF 10V
100PF 1 J3
1
2 S
3
2
GND
ETC1-1-13
MODULATED
T4 P 4 5
1 J4
GND
OUTPUT
CLK_P CVDD18
RC040 2
J1
25 2
CC040 2 CC040 2
T2 1
RC040 2
.1UF 3
R28
RC040 2
C19
R30 1K
CC0402
C16 DNP
4 P R13 VAL
ETC1-1-13
RC040 2
RC040 2
2 5 1
S
R31 R29 25 300
CC0402
Figure 84. Evaluation Board, TxDAC Clock Interface
07098-047
Rev. 0 | Page 59 of 64
C23 .1UF
C17 .1UF
CLK_N
AD9785/AD9787/AD9788
P4 P4 A1 D1 A2 D2 A3 D3 D4 D5 D6 D7 D8 D9 D10 D11 E6 E7 E8 E9 E10 E11 E5 E4 E3 A4 A5 A6 A7 A8 A9 A10 A11 B11 C11 B10 C10 B9 C9 B8 C8 B7 C7 B6 C6 B5 C5 B4 C4 B3 C3 E2 B2 C2 E1 B1 C1 P4
P4
P4
P2D0 P2D2 P2D4 P2D6 P2D8 P2D10 P2D12 P2D14
AD9785/AD9787/AD9788
P2D1 P2D3 P2D5 P2D7 P2D9 P2D11 P2D13 P2D15
A15 D15 A16 A17 A18 A19 A20 A21 A22 A23 A24 A25
PKG_TYPE=MOLEX110 VAL PKG_TYPE=MOLEX110 VAL
B15 B16 B17 B18 B19 B20 B21 B22 B23 B24 B25 C25 D25
PKG_TYPE=MOLEX110 VAL
C15 E15 E16 D17 D18 D19 D20 D21 D22 D23 D24 E17 E18 E19 E20 E21 E22 E23 E24 E25
PKG_TYPE=MOLEX110 VAL
C16 D16 C17 C18 C19 C20 C21 C22 C23 C24
P1D0 P1D2 P1D4 P1D6 P1D8 P1D10 P1D12 P1D14
P1D1 P1D3 P1D5 P1D7 P1D9 P1D11 P1D13 P1D15
07098-048
Figure 85. Evaluation Board, Digital Input Data Lines
Rev. 0 | Page 60 of 64
GND BLK TP7 BLK
PKG_TYPE=MOLEX110 VAL
J2
1
U2
2 1 2 3
P2 1
CC0603 CC0603
4 JP19
CVDD18_IN
1UF C86 C85
1UF
ADP3339-1-8
2
VAL CNTERM_2P
U3
1 2 3 JP20 1UF 1UF 4
DVDD18_IN
ADP3339-1-8
CC0603 CC0603
C89 C88
U4
1 2 3 JP21 4
DVDD33_IN
07098-049
Figure 86. Evaluation Board, On-Board Power Supply
Rev. 0 | Page 61 of 64
1UF 1UF
CC0603 CC0603
ADP3339-3-3
C92
C91
U7
1 2 3 4 JP22
AVDD33_IN
ADP3339-3-3
1UF
CC0603
1UF
CC0603
AD9785/AD9787/AD9788
C93
C94
AD9785/AD9787/AD9788 OUTLINE DIMENSIONS
0.75 0.60 0.45 SEATING PLANE 1.20 MAX
100 1 PIN 1
16.00 BSC SQ 14.00 BSC SQ
76 75 76 75 100 1
BOTTOM VIEW
(PINS UP)
TOP VIEW
(PINS DOWN)
CONDUCTIVE HEAT SINK 25 26 51 50 51 50 26 25
0.20 0.09 7 3.5 0
1.05 1.00 0.95
6.50 NOM
0.50 BSC
0.27 0.22 0.17
0.15 0.05
COPLANARITY 0.08
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HDT NOTES: 1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED. 2. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE DEVICE, WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS. 3. JA: 27.4C/W WITH THERMAL PAD UNSOLDERED, 19.1C/W WITH THERMAL PAD SOLDERED TO PCB.
Figure 87. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP] (SV-100-1) Dimensions shown in millimeters
ORDERING GUIDE
Model AD9785BSVZ 1 AD9785BSVZRL1 AD9787BSVZ1 AD9787BSVZRL1 AD9788BSVZ1 AD9788BSVZRL1 AD9785-EBZ1 AD9787-EBZ1 AD9788-EBZ1
1
Temperature Range -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Package Description 100-Lead TQFP_EP 100-Lead TQFP_EP 100-Lead TQFP_EP 100-Lead TQFP_EP 100-Lead TQFP_EP 100-Lead TQFP_EP Evaluation Board Evaluation Board Evaluation Board
Package Option SV-100-1 SV-100-1 SV-100-1 SV-100-1 SV-100-1 SV-100-1
RoHS Compliant Part.
Rev. 0 | Page 62 of 64
121207-A
AD9785/AD9787/AD9788 NOTES
Rev. 0 | Page 63 of 64
AD9785/AD9787/AD9788 NOTES
(c)2008 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D07098-0-1/08(0)
Rev. 0 | Page 64 of 64


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